Silicon-based MEMS Fabrication Techniques and Standardization

Yilong Hao

2007-01-01

Scientia Forestalis

Abstract:The silicon-based MEMS fabrication technology, including bulk micromachining and sacrificial layers technology have been developed and studied. The 3-D fabrication and integration of silicon-based MEMS and standard process fabrication have been studied in the present paper.

What problem does this paper attempt to address?

Silicon-Based Mems Process and Standardization

YL Hao,DC Zhang

DOI: https://doi.org/10.1109/icsict.2004.1435192

2004-01-01

Abstract:This paper, reviewing the development history of MEMS technology, summarizes the developing trend of current MEMS fabrication techniques. To realize the miniaturization and 3D fabrication of MEMS device, multi-layer techniques, SOI techniques and integration are the main developing directions of current MEMS. Standardization is an important tool of MEMS research and the standardization process covers two platforms: the soft platform and the hard platform, which will exert relatively large driving forces to MEMS device research.
TECHNOLOGY OF SILICON-BASED MEMS

郝一龙,张大成,李婷

DOI: https://doi.org/10.3969/j.issn.1671-7449.2002.z2.032

2001-01-01

Abstract:Concerning the development history of MEMS technology, the present paper introduces a state of the art developing direction of silicon based MEMS machining, indicating that there are two main developing directions. One is sacrificial layers technology, and the other is bulk micromachining. Sacrificial layers technology is developing towards multiple layers and integration. Bulk micromachining mainly includes combination of bonding and deep etching, pursuit to big mass and small stress, and three dimensional fabrications technology which is the developing direction of new body silicon technology. Standard process fabrication is becoming more and more important for MEMS study.
The Technology of Using Porous Silicon As a Sacrificial Layer in MEMS

周俊,谢克文,王晓红,刘理天

DOI: https://doi.org/10.3969/j.issn.1000-3819.2004.01.015

2004-01-01

Abstract:Porous silicon used as a sacrificial layer has some important applications in surface micromachining technology. Three different processes based on porous silicon as a sacrificial layer are discussed in detail. Freestanding microstructures are fabricated with the latter two separate techniques, then the deposition of film on the surface of porous silicon and masking layer in the fabrication of porous silicon are analyzed. All these provide solid foundation of fabricating diverse freestanding microstructures.
Microfabrication Technology of Three-Dimensional Microdevices and Their Mems Applications

JF Li

2002-01-01

Abstract:Recent status of microfabrication technology related to microelectromechanical systems (MEMS) is reviewed with particular emphasis on the introduction of our newly developed three-dimensional microfabrication process using a micromachined silicon wafer as a mold. By using the silicon molding processes, piezoelectric microrod arrays, thermoelectric microelement arrays and silicon carbide micro gas turbine rotors have been successfully fabricated, Their microfabrication processes are described in detail to demonstrate the success of the combination of silicon micromachining and materials processing techniques. The prospects for materials microfabrication in the fields of miniature medical apparatus and portable microscale energy sources are given.
The key technologies in silicon based microwave and RF MEMS device fabrication

Zewen Liu,XiaoFeng Lei,Yun Xuan,Jia Wei,Zhongmin Chen,Litian Liu,Zhijian Li

DOI: https://doi.org/10.1109/ICMMT.2004.1411436

2004-01-01

Abstract:In this paper, the key fabrication technologies used for microwave and radio frequency MEMS devices, namely RF-MEMS, are discussed. Our studies focus on the fabrication of inductor, capacitor and switch on silicon substrate. To reduce the substrate effect, substrate modification via porous silicon method is introduced, and high Q inductor has been realized porous silicon modification substrate is showed. The polyimide (PI) sacrificial layer technology is used for the switch and capacitor fabrication. To reduce the ohmic loss in transmission line for the RF devices used in the high frequency (around 2 GHz), a special process sequences is developed to realize the thick metallic plating. To illustrate the integrative capacity of RF MEMS with CMOS circuits, a VCO with flip-chip MOS and MEMS packaging is designed, which present minimized parasitic effects in the device interconnection.
Multi-layer Microstructure Fabrication by Combining Bulk Silicon Micromachining and UV-LIGA Technology

Xiang-meng Jing,Di Chen,Dong-ming Fang,Chuang Huang,Jing-quan Liu,Xiang Chen

DOI: https://doi.org/10.1016/j.mejo.2006.09.003

2007-01-01

Abstract:A novel method for fabrication of multi-layer microstructures of microelectro-mechanical system (MEMS) devices is described. This technique, which combines bulk silicon micromachining technique and UV-LIGA technique can overcome some shape limitations of single technique on complex microstructures. To demonstrate this combination, the SU-8 microstructure fabricated in the etched silicon grooves is presented. In this fabrication process, a SU-8 removal method by fuming sulfuric acid was introduced and a novel type of plastics PETG was tried in microhot embossing process. The proposed fabrication process can be applied to fabricating a high-aspect-ratio microstructure for a large displacement actuator and precision sensors. Moreover, this combined process enables the fabrication of more complex structures, which cannot be fabricated by bulk micromachining or UV-LIGA alone.
A CMOS Compatible Process for Monolithic Integration of High-Aspect-ratio Bulk Silicon Microstructures

Liang Qian,ZhenChuan Yang,GuiZhen Yan

DOI: https://doi.org/10.1007/s11432-014-5138-0

2014-01-01

Science China Information Sciences

Abstract:We report a CMOS compatible bulk micromachining method for the integration of high-aspect-ratio single crystal silicon MEMS (micro electromechanical systems) devices and signal conditioning circuit on a standard silicon wafer. The trench refilling and residual silicon removing techniques are used to acquire a proper electrical insulation between the different actuation and sensing elements situated on either fixed or movable parts of an MEMS device. To demonstrate the compatibility of the process, an integrated MEMS accelerometer was implemented. Test results show that the resistance between different elements of the device is larger than 1012 Ω. The electrical properties of the transistors that experienced MEMS fabrication agree well with those without MEMS process, indicting the CMOS compatibility of the process.
MEMS Microfabrication Technology Based on Rapid ProtoTyping

潘开林,陈子辰,付建中

DOI: https://doi.org/10.3321/j.issn:1004-132X.2002.20.004

2002-01-01

Abstract:Main microfabrication techniques for MicroElectroMechanical System (MEMS) are firstly commented on in this paper. The basic principle and framework of MEMS microfabrication system based on rapid prototyping are overviewed, and the microfabrication accuracy and examples are investigated. At last, a latest process called integral microstereolithography process in which a complete layer can be built using a single exposure is also reviewed with some examples.
3d Microfabrication Technology

Es Tang,Ft Yi,Yc Tian,Jq Liang,Dc Xian

DOI: https://doi.org/10.1117/12.317962

1998-01-01

Abstract:In the late of this century the great success of VSIC impacts into almost every fields of our social. Following this idea people starts to integrate microsensor microprocessor and microactuators into a small space to forming a Micro Electro and Mechanical System. Such small robot parts are applied to including satellites, computer communication, medical, chemical, biological and environment and so on research fields. The development of MEMS would strongly influence industrial revolution in the next century. LIGA technology including X-ray deep etching lithography; electroplating and plastic molding developed by Karlsruhe Nuclear Research Center, Germany since the beginning of 1980. Its advantages are: it could make three-dimensional microstructures with lateral dimension in several micron range and thickness of several hundred microns with sub-micron precision. In principle all kinds of materials such as polymer, metal and ceramic could be used as microcomponents and could be mass- produced by plastic molding to a commercially available fabrication. LIGA process has become one of the most promising Microfabrication technologies for producing micromechanical, microfluid and micro-optical elements. It opens an additional field in the microstructure market.
Novel 3-D Device Fabrication Process in Micro-Electronic Mechanical System Based on Nano-Imprint Lithography

Quandai Wang,Yugang Duan,Yucheng Ding,Bingheng Lu,Yajun Zhang

DOI: https://doi.org/10.3321/j.issn:0253-987X.2005.09.009

2005-01-01

Abstract:Based on the nanoimprint lithography (NIL) combining with layered manufacture principle, a novel three-dimensional micro-electronic mechanical system (MEMS) fabrication process is investigated. To accurately align the individual layers, an optical alignment system with video image principle is developed to improve the alignment accuracy to 2 μm. The photoresist with high resolution is made by reducing the viscosity and the solidification contraction ratio when the elasticity and solidification velocity are taken into account. Experiments are performed to optimize the process parameters of resist-coating, imprinting and template-separation, and the atomic force microscope (AFM) images of imprinting results show that the pattern replication error from mold to photoresist is less than 8%, which enables to manufacture complicated microstructures with higher efficiency and lower cost for MEMS device fabrication.
Fabrication of Sicn Mems Structures Using Microforged Molds

YP Liu,LA Liew,RL Luo,LN An,VM Bright,ML Dunn,JW Daily,R Raj

DOI: https://doi.org/10.1109/memsys.2001.906493

2001-01-01

Abstract:Ceramics and polymers are becoming attractive candidate materials for MEMS applications because of the wide range of properties that can be obtained and the promise of improved performance as compared to the existing materials set for MEMS. A challenge in the fabrication of ceramic MEMS is prohibiting cracking that can occur during processing. For example, this is significant in the development of a microcasting fabrication technique from a polymer precursor for silicon carbonitride (SiCN) MEMS. In this case, shrinkage mismatch between the SiCN structure and the microfabricated mold during thermal processes leads to significant stresses that can crack the ceramic structure. Here we propose an approach to overcome this problem that relies on demolding prior to the large shrinkage mismatch thermal processes, which itself is a nontrivial challenge. To this end, we propose a microforging process that facilitates demolding. We describe the process and show representative results for numerous SiCN ceramic microstructures.
Microelectromechanical System Technology and Its Application

张海涛,张斌

DOI: https://doi.org/10.3969/j.issn.1001-2028.2002.04.010

2002-01-01

Abstract:Microelectromechanical system (MEMS) technology makes it possible the moralization and integration of the products based on the material of silicon. This technology is divided into four categories: body, surface, metal and compound micromechanical processes. The basic technologies included in the micromechanical system are erosion, si-bond, multiplayer film sediment without stress, sacrifice layer, LIGA and the combined technologies based on them. The applications of micro-sensors, micro-machines, mechanism filter and resonant filters are presented, and the further development of technology is discussed.
Advances in MEMS Integrated Design and Manufacturing Technology

YUAN Weizheng,CHANG Honglong,XIE Jianbing

DOI: https://doi.org/10.3901/jme.2023.19.176

2023-01-01

Journal of Mechanical Engineering

Abstract:Chip technology has become a bottleneck restricting the development of high-quality in China,and the high-performance micro-sensor chip based on micro-electro-mechanical system(MEMS)technology is one of the bottlenecks devices in Europe and America."If you want to do something good,you must first improve your tool",similar to microelectronics chips,design and manufacturing technology is also the key to restricting the performance of MEMS chips.Firstly,starting from MEMS design methods and tools,reviews the development process of MEMS design methods from structured design methods of fixed processes to pan-structured design methods of arbitrary processes,introduces the advantages of arbitrary process design methods,introduces the mainstream commercial MEMS design tools in the world,and compares the advantages and disadvantages of typical design tools.Secondly,the characteristics and challenges of MEMS manufacturing technology are introduced,and several typical customized manufacturing technologies in the world and the single mask and selective release manufacturing methods proposed by Northwestern Polytechnical University are emphatically analyzed.Then the advantages of batch manufacturing technology are analyzed and the common batch foundry methods and typical batch foundry processes in China are given.Finally,the necessity of high-end MEMS design and manufacturing integration is pointed out,in order to provide reference for the development of China's MEMS mass manufacturing.
Silicon microstructuring technology

Walter Lang

DOI: https://doi.org/10.1016/0927-796x(96)00190-8

1996-09-01

Materials Science and Engineering: R: Reports

Abstract:Sensors, actuators and microsystems can be realized by silicon micromachining. The structures are typically three-dimensional. To realize them, the methods known from microelectronics are not suffucient but new structuring methods which allow deep etching are applied. For that reason, the microstructing of silicon is one of the characteristic and essential tasks of the technology of microelectromechanical systems (MEMS). In this review four important microstructing techniques are described: bulk micromachining by anistropic etching, reactive ion etching, surface micromachining and porous silicon technology. The basic principles are described, the technological realization is discussed and examples for applications in the field of microsensors are given.
Fabrication of SiCN MEMS by UV Lithography of Polysilazane

Huatao Wang,Zhipeng Xie,Weiyou Yang,Guoquan Liu,Linan An

DOI: https://doi.org/10.4028/www.scientific.net/kem.336-338.1477

2007-01-01

Key Engineering Materials

Abstract:A novel process with low cost to fabricate SiCN MEMS based on UV lithographic technique is present in this paper. The prepared MEMS are very promising to be used in high-temperature environments. By adding a photo initiator to the polysilazane precursor, the precursor becomes UV-sensitive and can be solidified upon exposure to UV light, which leads to the formation of UV photo lithographical patterns. Key issues of the fabrication process are investigated and various SiCN MEMS structures are fabricated by this technique.
Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Mingching Wu,Weileun Fang

DOI: https://doi.org/10.1088/0960-1317/15/3/014

2005-01-01

Journal of Micromechanics and Microengineering

Abstract:This work integrates multi-depth DRIE etching, trench-refilled molding, two poly-Si layers MUMPs and bulk releasing to improve the variety and performance of MEMS devices. In summary, the present fabrication process, named MOSBE II, has three merits. First, this process can monolithically fabricate and integrate poly-Si thin-film structures with different thicknesses and stiffnesses, such as the flexible spring and the stiff mirror plate. Second, multi-depth structures, such as vertical comb electrodes, are available from the DRIE processes. Third, a cavity under the micromachined device is provided by the bulk silicon etching process, so that a large out-of-plane motion is allowed. In application, an optical scanner driven by the self-aligned vertical comb actuator was demonstrated. The poly-Si micromachined components fabricated by MOSBE 11 can further integrate with the MUMPs devices to establish a more powerful MOEMS platform.
Scalable fabrication of carbon-based MEMS/NEMS and their applications: a review

Shulan Jiang,Tielin Shi,Xiaobin Zhan,Shuang Xi,Hu Long,Bo Gong,Junjie Li,Siyi Cheng,Yuanyuan Huang,Zirong Tang

DOI: https://doi.org/10.1088/0960-1317/25/11/113001

2015-09-25

Journal of Micromechanics and Microengineering

Abstract:The carbon-based micro/nano electromechanical system (MEMS/NEMS) technique provides a powerful approach to large-scale manufacture of high-aspect-ratio carbon structures for wafer-level processing. The fabricated three-dimensional (3D) carbon structures have the advantages of excellent electrical and electrochemical properties, and superior biocompatibility. In order to improve their performance for applications in micro energy storage devices and microsensors, an increase in the footprint surface area is of great importance. Various approaches have been proposed for fabricating large surface area carbon-based structures, including the integration of nanostructures such as carbon nanotubes (CNTs), graphene, nanowires, nanofilms and nanowrinkles onto 3D structures, which has been proved to be effective and productive. Moreover, by etching the 3D photoresist microstructures through oxygen plasma or modifying the photoresist with specific materials which can be etched in the following pyrolysis process, micro/nano hierarchical carbon structures have been fabricated. These improved structures show excellent performance in various applications, especially in the fields of biological sensors, surface-enhanced Raman scattering, and energy storage devices such as micro-supercapacitors and fuel cells. With the rapid development of microelectronic devices, the carbon-based MEMS/NEMS technique could make more aggressive moves into microelectronics, sensors, miniaturized power systems, etc. In this review, the recent advances in the fabrication of micro/nano hierarchical carbon-based structures are introduced and the technical challenges and future outlook of the carbon-based MEMS/NEMS techniques are also analyzed.

engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Si-based MEMS Resonant Sensor: A Review from Microfabrication Perspective

Gulshan Verma,Ankur Gupta

DOI: https://doi.org/10.31224/osf.io/tvk7s

2021-06-17

Abstract:With the technological advancement in micro-electro-mechanical systems (MEMS), microfabrication processes along with digital electronics together have opened novel avenues to the development of small-scale smart sensingdevices capable of improved sensitivity with a lower cost of fabrication and relatively small power consumption. This article aims to provide the overview of the recent work carried out on the fabrication methodologies adoptedto develop silicon based resonant sensors. A detailed discussion has been carried out to understand critical steps involved in the fabrication of the silicon-based MEMS resonator. Some challenges starting from the materialsselection to the ?final phase of obtaining a compact MEMS resonator device for its fabrication have also been explored critically.
Micro-electro-mechanical Systems Fast Fabrication by Selective Thick Polysilicon Growth in Epitaxial Reactor

O. De Sagazan,M. Denoual,P. Guil,D. Gaudin,O. Bonnaud

DOI: https://doi.org/10.1007/s00542-006-0176-1

2006-01-01

Microsystem Technologies

Abstract:A thick layer selective polysilicon growth technique has been developed for micro-electro-mechanical systems (MEMS) fabrication. It allows fast MEMS fabrication without using silicon on insulator wafers or deep ICPRIE etching. The fabrication technique is based on two main steps: a first seed layer of polysilicon is deposited and patterned; the second step consists in the selective growth of this layer in an epitaxial reactor. The first part of this work is devoted to the optimisation of growth parameters. Afterwards, this technique is applied for fabrication of different kinds of actuators, involving films several microns thick with good mechanical properties such as a low mechanical stress and a low roughness of the polysilicon film surface. Furthermore, thermal actuator prototypes were fabricated by using this technique;showing good mechanical properties and high reliability.
Fabrication Comparison of the SCS-Based and SOI-Based Micromachining

Qing Hua Chen,Yan Mei Li,Ying Jun Chen,Wen Gang Wu

DOI: https://doi.org/10.4028/www.scientific.net/amr.926-930.881

2014-01-01

Advanced Materials Research

Abstract:The two different fabrications of the Micro-Electro-Mechanical Systems (MEMS) mirrors were compared: a single-crystal-silicon (SCS)-based micromachining and a silicon-on-insulator (SOI)- based micromachining. While the SOI parts had significantly smaller curved device appearance, they were outperformed in most areas by the SCS parts. This was due primarily to the smaller stress factor in the device layer in the SOI parts compared to the polysilicon layer used in the SCS parts.

Silicon-based MEMS Fabrication Techniques and Standardization

Silicon-Based Mems Process and Standardization

TECHNOLOGY OF SILICON-BASED MEMS

The Technology of Using Porous Silicon As a Sacrificial Layer in MEMS

Microfabrication Technology of Three-Dimensional Microdevices and Their Mems Applications

The key technologies in silicon based microwave and RF MEMS device fabrication

Multi-layer Microstructure Fabrication by Combining Bulk Silicon Micromachining and UV-LIGA Technology

A CMOS Compatible Process for Monolithic Integration of High-Aspect-ratio Bulk Silicon Microstructures

MEMS Microfabrication Technology Based on Rapid ProtoTyping

3d Microfabrication Technology

Novel 3-D Device Fabrication Process in Micro-Electronic Mechanical System Based on Nano-Imprint Lithography

Fabrication of Sicn Mems Structures Using Microforged Molds

Microelectromechanical System Technology and Its Application

Advances in MEMS Integrated Design and Manufacturing Technology

Silicon microstructuring technology

Fabrication of SiCN MEMS by UV Lithography of Polysilazane

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Scalable fabrication of carbon-based MEMS/NEMS and their applications: a review

Si-based MEMS Resonant Sensor: A Review from Microfabrication Perspective

Micro-electro-mechanical Systems Fast Fabrication by Selective Thick Polysilicon Growth in Epitaxial Reactor

Fabrication Comparison of the SCS-Based and SOI-Based Micromachining