Abstract:The mature CMOS fabrication processes are available in many IC foundries. It is cost-effective to leverage the existing CMOS fabrication technologies to implement MEMS devices. On the other hand, the MEMS devices could also add values to the IC industry as the Moore's law reaching its limit. The CMOS MEMS could play a key role to bridge the gap between the CMOS and MEMS technologies. The CMOS MEMS also offers the advantage of monolithic integration of ICs and micro mechanical components. This study introduces the post-CMOS processes to implement and integrate various MEMS transducers after the standard CMOS processes. The wafer bonding and thinning technology will further add variety of CMOS and MEMS integration. Note that other process platforms (e.g. poly-Si, CNT, glass, metal, etc.) are also of importance for different MEMS applications. In future, these process platforms could help to enhance the diversification and performance of on-chip devices as we move towards the “More than Moore” era.

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