Microelectronic Package Technology of Striding Forward New Millenary

况延香,马莒生

DOI: https://doi.org/10.3969/j.issn.1001-3474.2000.01.001

2000-01-01

Abstract:Discuss the current situation and future of microelectronic package.Put forward a few development trends and look forward SLIM package prospects of striding new millenary.At the same time,make out the close relation between IC chip and microelcetronic package technology.

What problem does this paper attempt to address?

The New Development of Mico-Electronic Assembly and Packaging Technology

龙绪明,罗爱玲,贺海浪,刘明晓,曹宏耀,董健腾,吕文强,胡少华

DOI: https://doi.org/10.3969/j.issn.1004-4507.2014.09.001

2014-01-01

Abstract:the new developm ent of m ico-electronic assem bly and packaging technology is described, including The IC Virtual Manufacturing Training System . The m ico-electronic assem bly technology based on SMT is achieved the am algam ation betw een the IC packaging and board circuit assem bly, and is developed in the direction of com bining the IC packaging w ith SMT equipm ent. The m ico-electronic packaging technology based on IC packaging is developed in the direction of 3D packaging and m ico-m echaelectronic packaging.
A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

MIAO Min,JIN Yu-feng

DOI: https://doi.org/10.19304/j.cnki.issn1000-7180.2021.01.001

2021-01-01

Abstract:More than Moore has become the preferred strategy for integrated circuit and electronic, information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage, whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred, triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently, based on the personal scientific research practice, the characteristics, connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage, from the perspective of architecture evolution, chip-package co-design strategy, multi-physics co-analysis and co-optimization, and major technical innovations in integrated assembling and manufacturing; in addition, the future applications are prospected and the path of evolution is suggested.
Recent Development of Electronic Packaging Technology

Fu Yuepeng,Tan Kai,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2009.02.003

2009-01-01

Abstract:The current IC line width characteristics is near sub-0.1 nm scale,according to the quantum effect,it will be the ultimate size of the semiconductor integration.The miniaturization process of electronic products will depend on the packaging technology.The current 3D SiP packaging technology,resin-core bump COG package on LCD panels,and low-temperature soldering are summarized.It also focuses on the 3D package-stack FFCSP packaging technology.The trend in development of electronic packaging technology is also pointed out,it reveals that the emergency of these technologies is the foundation for finer electronic packaging coming into reality.
Technologies for PCB and electronic package in the future

Min-bo TIAN

DOI: https://doi.org/10.3969/j.issn.1009-0096.2015.09.012

2015-01-01

Abstract:The ITRS 2012 ROAD MAP describes that IC chip will develop of IC chip to fine pitch, more I/O pinns, high speed continuously, as well as that the electronic packages are transforming from 2 maintain to 3 maintain. No matter for package substrate, inter poser, mother board, or for backplane board, the forms, structures, manufacture processes and technologies must suit the development and transformation. This paper introduces technologies for PCB and electronic package in the future.
Recent development trend of PCB technologies

Min-bo TIAN

DOI: https://doi.org/10.3969/j.issn.1009-0096.2015.10.003

2015-01-01

Abstract:Along with the development of IC chip to fine pitch, more I/O pins ,high speed, as well as the electronic products to be lighter, thinner, smaller, with high properties and more performance, it is necessary for PCB and electronic package to match IC Chip and electronic products. Therefore the requirements to PCB and electronic package in the forms, structures, manufacture processes and technologies, particularly in the used materials, are more and more high. This paper introduces recent development trend of technologies.
The state of art on the micro-joining and nano-joining technologies

Shang WANG,Yanhong TIAN

DOI: https://doi.org/10.11951/j.issn.1005-0299.20160464

IF: 1.8

2017-01-01

Materials Science and Technology

Abstract:In recent years, integrated circuit ( IC) is developing towards high integration level, leading to the continuing miniaturization of electronic packages and the change of packages′ structure. Meanwhile, the IC technology, as an important part of information revolution, always connects and interactives with various fields, such as Micro-Electro-Mechanical System ( MEMS ) , Precision Instrument and Machinery, and Flexible Devices. As a key technology of electronic packages, the development of nano- and micro- joining technology is directly related to R&D and technological innovation of new generation of package structures in electronic industry. Hence, the development of nano- and micro- joining technology has a strong relationship with multiple fields. In this paper, the progress of 3D electronics fabrication and nano-joining technology is summarized . Through summarizing the research and application status of micro-joining and nano-joining under different scales, the significance of micro- joining and nano- joining technology in electronic industry is clarified. Moreover, the outline of the present and future research directions is provided.
Challengeable Mechanical Issues in Microelectronic Packages for Developments

Xiangdong Xue,Jianghao Wei,Yuming Wang,Jianxin Yang

DOI: https://doi.org/10.1109/icept52650.2021.9567903

2021-01-01

Abstract:With the slowdown of the progressive pace of miniaturization, the development of microelectronic systems shows diverse features. This leads to the emergence of new types of packages and challenges, demanding systematic approaches to sort out characteristic issues, increase insightful visions and map out progressive schemes. Focusing on mechanical characterization, this paper identifies mechanical challenges emerged in the current and future progresses of microelectronic packages. Mechanical challenges are firstly identified from the three categories of new issues, thermal interfaces and new structural patterns to highlight the key points. This is then followed by a discussion of mechanical characterization on the aspects of the domination of surface effects, the coupling of material-structural integration and the advent of multiphysical systems to describe the main schemes. Finally, mechanical issues expected in the ongoing future are analyzed through three aspects of stacked 3D structures, in-situ packages and nanomechanics to give a perspective view. Miniaturization is highlighted as the fundamental reason bringing significant changes and issues to mechanics. The interactive couplings on interfaces and between nanomaterial phases are emphasized as the phenomenal issues for mechanical investigations. By highlighting the characteristics and challenges with mechanics, this paper roughly profiles a framework of mechanical issues of microsystems.
The Conception of MEMS and Current Development at Home and Abroat

刘文耀,杜君文,应济

DOI: https://doi.org/10.3969/j.issn.1002-2333.2001.02.002

2001-01-01

Abstract:The principle and relevant technology of GEMS are introduced. The current development of this technology at home and abroad and the prospect are also involved.
Recent Development of Micro Electronic Packaging Materials

Chen Junjun,Fu Yuepeng,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2008.03.001

2008-01-01

Abstract:The recent situation of researching and making of key packaging materials are summarized,including BUM,FPC,lead-free solder,ACA etc.The problems of development and trend in future are given.BUM and FPC will be main substitute materials in the 21st century to fit three-dimensional packaging and the technology will be simpler and cheaper.Lead-free solder accords with environmentalism,but its cost remains high.Electric glue will be a new connection material to replace solder at low temperature.
Recent advances in nano-materials for packaging of electronic devices

Shuye Zhang,Xiangyu Xu,Tiesong Lin,Peng He

DOI: https://doi.org/10.1007/s10854-019-01790-3

2019-01-01

Abstract:In recent years, Moore’s law had a remarkable effect on predicting the development of semiconductor technology. As the size of devices shrinks to micro scale or nano scale, Intel’s newest 10-nm logic technology is scheduled to start product shipments before the end of 2017. Moore’s law will not die out, as the research scale reaches the atomic scale, “new devices” and new interconnection methods are urgently needed. In this paper, based on emerging interconnection requirement, the contribution to the advanced electronic packaging containing novel nano-materials, such as the carbon nanotubes, nanoparticles sintering, interconnection of nano-solder, nano-silver and surface plasma nano-welding are discussed. For the next 5–10 years, two new types of interconnect solutions are gaining attentions: solder joint alternatives and Cu electrode alternatives. The former uses new materials such as graphene, carbon nanotubes and nanowires to replace traditional solder joints. The latter uses optical media to replace the traditional Cu metal. In general, advanced materials will make more and more outstanding contributions in the development of electronic packaging in the next 10–20 years.
The Research Status and Development Trends of System in Package(SiP) Technology

Hu Yang,Cai Jian,Cao Liqiang,Chen Lingzhi,Liu Ziyu,Shi Lulu,Wang Qian

DOI: https://doi.org/10.3969/j.issn.1004-4507.2012.11.001

2012-01-01

Abstract:System in Package(SiP) has become one of the most important advanced assembly and integrated technology.It is important technology roadmap of miniaturization and multi-function of electronic products in future.SiP has wide market in application and prospective development of microelectronics and electronics manufacture.This article is a brief description of current status and development trend of SiP technology.Especially this article focus on the research and development on SiP technology by international semiconductor industry and main institutes.Furthermore there is brief review and prospective on SiP technology development in our country.
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo

DOI: https://doi.org/10.1109/temc.2010.2048755

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
Research on a New Type of Micro-Device Packaging Technology

皇甫勇,王小鹏,陈花玲

DOI: https://doi.org/10.3969/j.issn.1671-4776.2004.12.006

2004-01-01

Abstract:A comprehensive introduction to the MEMS device packaging technology,in cluding its history,its influence and the present situation of its development i s given. New type of degradable high polymer drag-delivering micro-structure i s briefly described. In response to the particular features of this high polymer drag-delivering micro-device. Finally,a new type of vacuum-heat-melt packag ing technology was put forward.
Advanced packaging technology for MEMS

王海宁,王水弟,蔡坚,贾松良

DOI: https://doi.org/10.3969/j.issn.1003-353X.2003.06.004

2003-01-01

Abstract:Some particularities for MEMS packaging:special signal interfaces, 3D-structureconfigurations, requirements of cases, passivation and reliability are summarized in this paper.Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. The research and development of MEMSpackaging should be strengthened.
Modern IC packaging trends and their reliability implications

R. Plieninger,M. Dittes,K. Pressel

DOI: https://doi.org/10.1016/j.microrel.2006.08.008

IF: 1.6

2006-09-01

Microelectronics Reliability

Abstract:Reliability aspects are of extreme importance for assembly and packaging, which has become a limiting factor for both cost and performance of electronic systems. On the one hand reliability can be negatively influenced by modern front-end and packaging technology, on the other hand new applications and corresponding field requirements can result in the need for new reliability tests e.g. for mobile devices. Today the three main package trends for mobile devices towards ongoing miniaturization and higher system integration are ball grid array type packages, leadless packages, and wafer level type packages. We present reliability implications based on examples of failures in these modern packaging technologies. We highlight the importance of design for reliability based on results of simulations for a leadless package. For the future it is necessary that test conditions must follow the field requirements to guarantee optimum reliability results.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Haoyu Wang,Jianshe Ma,Yide Yang,Mali Gong,Qinheng Wang

DOI: https://doi.org/10.3390/mi14061149

IF: 3.4

2023-05-30

Micromachines

Abstract:The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
A Review of Chip Scale Package Technology

杜晓松,杨邦朝

DOI: https://doi.org/10.3969/j.issn.1004-3365.2000.06.014

2000-01-01

Abstract:Chip scale package (C SP) is a new microelectronic package technology rapidly developed in recent years. The concept of CSP is introduced in this pa per. Its features and types are described. And the application perspectives a re also discussed.
Package Technology for Microcavities

Wen-Dong Zhang,Ying-Zhan Yan,Jun Liu,Shu-Bin Yan,Chen-Yang Xue,Ji-Jun Xiong

DOI: https://doi.org/10.1117/12.893474

2011-01-01

Abstract:Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.
Advanced Packaging Trends in the Semiconductor Industry

Yuchen Ye

DOI: https://doi.org/10.54097/5ygk2189

2024-04-09

Abstract:Advanced packaging is an important technology that is now taking over from advanced processes to help the semiconductor industry continue to grow. The researcher found that the personnel in contact with the semiconductor industry chain have already had a preliminary understanding of advanced packaging, however, the future development trend of the advanced packaging industry still lacks a comprehensive knowledge. Therefore, the research topic of this paper is the development trend of advanced packaging industry. The research methodology of this paper is as follows: firstly, to understand the concept and development trend of advanced packaging, secondly, to list the factors driving the development of advanced packaging, and finally, to understand the development direction of international enterprises in advanced packaging. This paper finds that after the chip process technology has entered the "post-Moore era", advanced packaging has been widely used in the fields of high-end logic chips, memories, RF chips, image processing chips, touch chips and so on. Advanced packaging technology tends to be diversified in function, stacking and connection. According to Yole, a market research organization, the global share of advanced packaging in the IC packaging and testing market will continue to increase. At the same time, Yole predicts that the global compound annual growth rate of traditional packaging will be only 1.9% from 2019 to 2025, which is much lower than the growth rate of advanced packaging. Advanced packaging is the key path to improve system performance in the post-Moore era.
Development Trend of Chinese Integrated Circuit Industry and Science and Technology in 21 Century

Wang Yongwen

Abstract:This paper briefly reviews the history of the world economics and the development of integrated circuit industry.It is indicated that "Green Micro-Nanoelectron" will become a significant component of the low-carbon economic society.In this context,this paper analyzes the market of China's integrated circuit,the present status of China's IC industry and IC technology,the opportunity and challenges for the main land of China.This paper also discusses the Micro-Nano new structure device,the green integrated circuit manufacture,the development trend of low-power IC design.It is thought that reducing energy consumption and raising the rate of performance of power consumption are going to be the main driving force for the development of ICs and the systems.Finally some comments are made concerning the development goal of China's IC industry,including the fields of technology progress,institutional reform,talent cultivation and industry environment.This paper is divided into four chapters.(1) Chapter one addresses the neo-industrialization in the mainland of China and reveals the objective laws governing the development of an industrial society.(2) Chapter two shows that China is still in the stage as a leading power of IC consumption.(3) Chapter three describes the development road of the IC industry in the mainland of China.There are five points worth mentioning.Firstly,China is a lake of information industry's core competency.Second point concerns the relationship between IC development and energy consumption.Thirdly,the planning of industrial breakthroughs in China is to give a high priority to the design industry and the innovative design should be based on the system requirements and low power consumption.Fourthly,China should reinforce the manufacturing industrial foundation,raise the technical level,strengthen the serviceability and save energy consumption.Fifthly,China should grasp the historic opportunity in the 2020—2030s and make significant breakthroughs in the IC science and technology.(4) Chapter four illustrates that the institutional reform and the cultural evolution are the essential conditions of the sustainable development for IC industry in particular and the science and technology in general.

Engineering,Environmental Science

Microelectronic Package Technology of Striding Forward New Millenary

The New Development of Mico-Electronic Assembly and Packaging Technology

A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

Recent Development of Electronic Packaging Technology

Technologies for PCB and electronic package in the future

Recent development trend of PCB technologies

The state of art on the micro-joining and nano-joining technologies

Challengeable Mechanical Issues in Microelectronic Packages for Developments

The Conception of MEMS and Current Development at Home and Abroat

Recent Development of Micro Electronic Packaging Materials

Recent advances in nano-materials for packaging of electronic devices

The Research Status and Development Trends of System in Package(SiP) Technology

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Research on a New Type of Micro-Device Packaging Technology

Advanced packaging technology for MEMS

Modern IC packaging trends and their reliability implications

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

A Review of Chip Scale Package Technology

Package Technology for Microcavities

Advanced Packaging Trends in the Semiconductor Industry

Development Trend of Chinese Integrated Circuit Industry and Science and Technology in 21 Century