Challengeable Mechanical Issues in Microelectronic Packages for Developments

Xiangdong Xue,Jianghao Wei,Yuming Wang,Jianxin Yang

DOI: https://doi.org/10.1109/icept52650.2021.9567903

2021-01-01

Abstract:With the slowdown of the progressive pace of miniaturization, the development of microelectronic systems shows diverse features. This leads to the emergence of new types of packages and challenges, demanding systematic approaches to sort out characteristic issues, increase insightful visions and map out progressive schemes. Focusing on mechanical characterization, this paper identifies mechanical challenges emerged in the current and future progresses of microelectronic packages. Mechanical challenges are firstly identified from the three categories of new issues, thermal interfaces and new structural patterns to highlight the key points. This is then followed by a discussion of mechanical characterization on the aspects of the domination of surface effects, the coupling of material-structural integration and the advent of multiphysical systems to describe the main schemes. Finally, mechanical issues expected in the ongoing future are analyzed through three aspects of stacked 3D structures, in-situ packages and nanomechanics to give a perspective view. Miniaturization is highlighted as the fundamental reason bringing significant changes and issues to mechanics. The interactive couplings on interfaces and between nanomaterial phases are emphasized as the phenomenal issues for mechanical investigations. By highlighting the characteristics and challenges with mechanics, this paper roughly profiles a framework of mechanical issues of microsystems.