Development of Packaging Technologies for Microsystems

JINYu-feng,WANGZhen-feng,- Weijun

2003-01-01

Abstract:It is well known that packaging plays a very important role in developing microsystems. Packaging accounts for about 60%～80% of cost and function of a microsystem. Package is required to provide mechanical protection, media separation or coupling, signal conditioning, etc.

What problem does this paper attempt to address?

Advanced packaging technology for MEMS

王海宁,王水弟,蔡坚,贾松良

DOI: https://doi.org/10.3969/j.issn.1003-353X.2003.06.004

2003-01-01

Abstract:Some particularities for MEMS packaging:special signal interfaces, 3D-structureconfigurations, requirements of cases, passivation and reliability are summarized in this paper.Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. The research and development of MEMSpackaging should be strengthened.
Recent Development of Electronic Packaging Technology

Fu Yuepeng,Tan Kai,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2009.02.003

2009-01-01

Abstract:The current IC line width characteristics is near sub-0.1 nm scale,according to the quantum effect,it will be the ultimate size of the semiconductor integration.The miniaturization process of electronic products will depend on the packaging technology.The current 3D SiP packaging technology,resin-core bump COG package on LCD panels,and low-temperature soldering are summarized.It also focuses on the 3D package-stack FFCSP packaging technology.The trend in development of electronic packaging technology is also pointed out,it reveals that the emergency of these technologies is the foundation for finer electronic packaging coming into reality.
Package Technology for Microcavities

Wen-Dong Zhang,Ying-Zhan Yan,Jun Liu,Shu-Bin Yan,Chen-Yang Xue,Ji-Jun Xiong

DOI: https://doi.org/10.1117/12.893474

2011-01-01

Abstract:Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.
SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ISOLATION CAVITY

Xu Zhiwei,Gao Huiyan,Li Min,Li Nayu,Zhang Zijiang,Wang Shaogang

2021-01-01

Abstract:Disclosed in the present invention is a semiconductor package structure having a micro-isolation cavity, comprising a multi-channel or multi-module semiconductor chip, a heat conductive substrate, a fixing filler, metal solder balls, metal wiring layers, dielectric layers, and via holes. A groove slightly larger than the chip is formed on the heat conductive substrate, the chip is placed in the groove in a flip-chip manner and bonded with the heat conductive substrate, and a chip pad is connected to a laminated circuit board below the chip pad by means of the metal solder balls. The laminated circuit board is provided with multiple metal wiring layers, the metal wiring layers are isolated by the dielectric layers, and different metal wiring layers are interconnected using the via holes. The chip is divided into different areas depending on channels or modules, the metal solder balls are closely arranged on the peripheral boundary of each area, and the chip, the metal solder balls, and the laminated circuit board form a micro-isolation cavity structure capable of effectively reducing electromagnetic coupling between the channels or modules. According to the present invention, the package volume is reduced, the transmission loss of a signal on an interconnection line is reduced, the degree of isolation between the channels or modules of the chip is effectively improved, and the system performance is improved.
MEMS vacuum packaging technology and applications

Jin, Y.,Wang, Z.F.,Lim, P.C.,Pan, D.Y.,jun wei,c k wong

DOI: https://doi.org/10.1109/EPTC.2003.1271534

2003-01-01

Abstract:Vacuum packaging is essential for various kinds of microelectromechanical system (MEMS) devices for enhancing the performance and reliability. This paper presents our works on research on vacuum packaging of MEMS devices. A hermetical sealing technique has been developed, which involves the processes of anodic bonding for silicon and glass wafers with imperfect interface, adhesive bonding, glass frit bonding and silicon-to-gold eutectic bonding. Vacuum maintenance has been achieved by applying evaporable and nonevaporable getter films in the packaging process. A specific helium leak detector with bombing system is introduced, which can monitor the deformation of micro diaphragms and conduct leak detection for MEMS structures.
A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

MIAO Min,JIN Yu-feng

DOI: https://doi.org/10.19304/j.cnki.issn1000-7180.2021.01.001

2021-01-01

Abstract:More than Moore has become the preferred strategy for integrated circuit and electronic, information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage, whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred, triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently, based on the personal scientific research practice, the characteristics, connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage, from the perspective of architecture evolution, chip-package co-design strategy, multi-physics co-analysis and co-optimization, and major technical innovations in integrated assembling and manufacturing; in addition, the future applications are prospected and the path of evolution is suggested.
Recent Development of Micro Electronic Packaging Materials

Chen Junjun,Fu Yuepeng,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2008.03.001

2008-01-01

Abstract:The recent situation of researching and making of key packaging materials are summarized,including BUM,FPC,lead-free solder,ACA etc.The problems of development and trend in future are given.BUM and FPC will be main substitute materials in the 21st century to fit three-dimensional packaging and the technology will be simpler and cheaper.Lead-free solder accords with environmentalism,but its cost remains high.Electric glue will be a new connection material to replace solder at low temperature.
Packaging Investigation of Optoelectronic Devices

Zhang Zhike,Liu Yu,Liu Jianguo,Zhu Ninghua

DOI: https://doi.org/10.1088/1674-4926/36/10/101001

2015-01-01

Journal of Semiconductors

Abstract:Compared with microelectronic packaging, optoelectronic packaging as a new packaging type has been developed rapidly and it will play an essential role in optical communication. In this paper, we try to summarize the development history, research status, technology issues and future prospects, and hope to provide a meaningful reference.
Challengeable Mechanical Issues in Microelectronic Packages for Developments

Xiangdong Xue,Jianghao Wei,Yuming Wang,Jianxin Yang

DOI: https://doi.org/10.1109/icept52650.2021.9567903

2021-01-01

Abstract:With the slowdown of the progressive pace of miniaturization, the development of microelectronic systems shows diverse features. This leads to the emergence of new types of packages and challenges, demanding systematic approaches to sort out characteristic issues, increase insightful visions and map out progressive schemes. Focusing on mechanical characterization, this paper identifies mechanical challenges emerged in the current and future progresses of microelectronic packages. Mechanical challenges are firstly identified from the three categories of new issues, thermal interfaces and new structural patterns to highlight the key points. This is then followed by a discussion of mechanical characterization on the aspects of the domination of surface effects, the coupling of material-structural integration and the advent of multiphysical systems to describe the main schemes. Finally, mechanical issues expected in the ongoing future are analyzed through three aspects of stacked 3D structures, in-situ packages and nanomechanics to give a perspective view. Miniaturization is highlighted as the fundamental reason bringing significant changes and issues to mechanics. The interactive couplings on interfaces and between nanomaterial phases are emphasized as the phenomenal issues for mechanical investigations. By highlighting the characteristics and challenges with mechanics, this paper roughly profiles a framework of mechanical issues of microsystems.
Microsystem Product Development

M. -A. Polosky,E. -J. Garcia,M.-A. Polosky,E.-J. Garcia

DOI: https://doi.org/10.48550/arXiv.0711.3274

2007-11-21

Other Computer Science

Abstract:Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.
Packaging a RF-MEMS system

杨宇,蔡坚,刘泽文,王水弟,贾松良

DOI: https://doi.org/10.3969/j.issn.1003-353X.2004.05.014

2004-01-01

Abstract:Radio frequency(RF)technology is widely used in the field of moderncommunication. The components obtained through MEMS technologies are smaller in size, lower incost, multifunctional, and lead to more compact integration as well. The SIP (system in a package)with lower parasitic effect and higher integration satisfy the RF-MEMS system. Packaging a RF-MEMS system is studied in this paper. Meanwhile, some key techniques related to RF SIP, includingstructure of package, integration of components, interconnection and package materials, are ana-lyzed in this paper
Study on Packaging Characteristics of Micro Acoustic Devices

YANG Yi,REN Tian-ling,CAI Jian,WANG Shui-di,LIU Li-tian

DOI: https://doi.org/10.3969/j.issn.1671-4776.2007.07.014

2007-01-01

Abstract:The micro acoustic devices were packaged by TO-CAN and SMT(surface mount technology) respectively.Frequency response and directive property of the packaged devices were measured by coupled cavity technique and corresponding setups.Test results reveal that high frequency response of micro audio frequency devices can be suppressed by decreasing the diameter of front inlet hole for sound.Different packaging parameters of micro ultrasonic devices result in ∞-shape and cordate directivity.
Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu,Yongjun Huo

DOI: https://doi.org/10.3390/ma16062346

IF: 3.4

2023-03-16

Materials

Abstract:Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...]

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering
A Study on Packaging of PZT MEMS Microphone

J Cai,HN Wang,SD Wang,XM Wu,TL Ren,SL Jia

DOI: https://doi.org/10.1109/ectc.2005.1441405

2005-01-01

Abstract:Packaging is the key issue in the commercialization of micromechanical microphone (also known as MEMS microphone). The ferroelectric-micromechanical microphone would have higher sensitivity and better acoustics performance. The microphone's package will play a role in protecting the MEMS microphone chip, providing signal channel, shielding the electromagnetism interference from circumference as well. Furthermore, the acoustic performance of microphone is affected by package construction. The design and fabrication of a surface mount package for the PZT microphone is presented in this paper. The microphone chip and amplifier are integrated on an organic substrate, on which a metal cap is attached for EMI shielding. The sensitivity at 1kHz is -36.8dB (14.5mV/Pa) for packaged microphone. The selection of adhesives has been optimized to ensure enough shear strength and satisfied performance. Three types of adhesives were used for die attachment. Optical profiler was used to measure the surface topography of the PZT film before and after attachment. A comparison of failure modes after shear test, for different adhesives was made for materials selection. The acoustic performance affected by different configuration of the package has been investigated. The inlet hole on the cap can restrain the response at high frequency. Packaged microphones were evaluated after thermal cycling and thermal storage.
Recent Advances and Trends in Advanced Packaging

John H. Lau

DOI: https://doi.org/10.1109/tcpmt.2022.3144461

2022-02-01

Abstract:In this study, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2-D, 2.1-D, 2.3-D, 2.5-D, and 3-D IC integration, which will be presented and discussed. Chiplet design and heterogeneous integration packaging provide alternatives to the system on chips (especially for advanced nodes) will be discussed. Different substrates, such as size, pin-count, and metal linewidth and spacing for advanced packaging, are examined. The lateral communication between chiplets, such as the silicon bridges embedded in organic build-up package substrate and fan-out epoxy molding compound, as well as flexible bridges, will be presented. Fan-in packaging, such as the six-side molded wafer-level chip-scale package (WLCSP) and its comparison with the ordinary WLCSP, are presented. Fan-out packaging, such as the chip-first with die face-up, chip-first with die face-down, and chip-last and their difference, will be provided. Low-loss dielectric materials for high-speed and high-frequency applications in advanced packaging will be presented. Flip-chip assembly by mass reflow, thermocompression bonding, and bumpless hybrid bonding will be briefly mentioned first.
High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Ping Guo,Hongling Meng,Lin Dan,Hao Xu,Jianye Zhao

DOI: https://doi.org/10.3390/app11188536

2021-01-01

Applied Sciences

Abstract:Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.
Investigation Of A Unified Ltcc-Based Micromachining And Packaging Platform For High Density/Multifunctional Microsystem Integration

Min Miao,Yufeng Jin,Hua Gan,Jing Zhang,Yunsong Qiu,Yang Zhang,YangFei Zhang,Rui Cao,Zhensong Li,ZhengYi Wang,FangQing Mu,Chengchen Gao

DOI: https://doi.org/10.1109/ECTC.2012.6248858

2012-01-01

Abstract:3D system-in-package has recently been considered a major enabler for high density and heterogeneous microsystem integration. We hereby proposed the concept of a unified micromachining and packaging platform based on LTCC (low temperature cofired ceramic) material system and process, which is implemented by first enhancing an existing LTCC hybrid IC fabrication line and then integrating different LTCC micromachining process modules one by one. Hence, the unified process flow can be accomplished within just one single package-test house. The platform has been capable of micromachining basic 3D MEMS (micro electromechanical system) microstructures into LTCC laminates and using them as a packaging substrate for mounting IC/MEMS from other process platforms, realizing self-contained and versatile microsystems of high density. The 3D microstructures formation process consisting of green tape machining, lamination and cofiring are demonstrated. The designing, analysis and fabricated samples of various micro functional structure enabled by the platform are illustrated, including embedded cooling microchannels (capable of lowering substrate temperature by more than 50K), microaccelerometer for harsh environment, micro Pirani gauge for in-situ vacuum level monitoring and THz (tera hertz) vacuum microelectronic devices. Samples of overall packaged MEMS and IC chips with micromachined LTCC substrate are displayed, showing ultra-low leakage (< 5 x 10(-11) Pa . m(3)/s) vacuum packaging capability and significantly enhanced device performance. In addition, the platform has demonstrated the potential of stacking several laminates with mounted chips into a 3D frame-like microsystem. In comparison, 3D integration purely based on Si micromachining, e. g. anodic-bonding based in-situ wafer encapsulation, may only support a very limited spectrum of devices/materials and integration density and is somehow too expensive for many MEMS researchers.
A Micro and Low-Cost Packaging Technology of High Accuracy Piezoresistive Pressure Sensors with Parylene Coating.

Shaoxiao Nie,Yilong Hao,Fanrui Meng,Chenhchen Gao,Zhenchuan Yang

DOI: https://doi.org/10.1109/nems57332.2023.10190892

2023-01-01

Abstract:Packaging technology for pressure sensors has always been a problem for protecting sensors applied in harsh environments. In this research, a micro, low – cost packaging method with high dynamic response for the application of high accuracy piezoresistive pressure sensors in corrosive and conductive medium is proposed. Tests for the performance of high accuracy sensors indicate that the method has small package effect and is low-cost than traditional encapsulation process.
Advanced Packaging Trends in the Semiconductor Industry

Yuchen Ye

DOI: https://doi.org/10.54097/5ygk2189

2024-04-09

Abstract:Advanced packaging is an important technology that is now taking over from advanced processes to help the semiconductor industry continue to grow. The researcher found that the personnel in contact with the semiconductor industry chain have already had a preliminary understanding of advanced packaging, however, the future development trend of the advanced packaging industry still lacks a comprehensive knowledge. Therefore, the research topic of this paper is the development trend of advanced packaging industry. The research methodology of this paper is as follows: firstly, to understand the concept and development trend of advanced packaging, secondly, to list the factors driving the development of advanced packaging, and finally, to understand the development direction of international enterprises in advanced packaging. This paper finds that after the chip process technology has entered the "post-Moore era", advanced packaging has been widely used in the fields of high-end logic chips, memories, RF chips, image processing chips, touch chips and so on. Advanced packaging technology tends to be diversified in function, stacking and connection. According to Yole, a market research organization, the global share of advanced packaging in the IC packaging and testing market will continue to increase. At the same time, Yole predicts that the global compound annual growth rate of traditional packaging will be only 1.9% from 2019 to 2025, which is much lower than the growth rate of advanced packaging. Advanced packaging is the key path to improve system performance in the post-Moore era.
MEMS Technology Status and Development Prospects

G. Yu.

Abstract:The development status,processing technologies and product markets of Micro Electro Mechanical Systems(MEMS) technology are introduced.The packaging technology and existing problems of MEMS product are mainly discussed,combining the MEMS materials and processing techniques,and the development prospects of MEMS technology are prospected.

Engineering,Materials Science

Development of Packaging Technologies for Microsystems

Advanced packaging technology for MEMS

Recent Development of Electronic Packaging Technology

Package Technology for Microcavities

SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ISOLATION CAVITY

MEMS vacuum packaging technology and applications

A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

Recent Development of Micro Electronic Packaging Materials

Packaging Investigation of Optoelectronic Devices

Challengeable Mechanical Issues in Microelectronic Packages for Developments

Microsystem Product Development

Packaging a RF-MEMS system

Study on Packaging Characteristics of Micro Acoustic Devices

Advanced Electronic Packaging Technology: From Hard to Soft

A Study on Packaging of PZT MEMS Microphone

Recent Advances and Trends in Advanced Packaging

High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Investigation Of A Unified Ltcc-Based Micromachining And Packaging Platform For High Density/Multifunctional Microsystem Integration

A Micro and Low-Cost Packaging Technology of High Accuracy Piezoresistive Pressure Sensors with Parylene Coating.

Advanced Packaging Trends in the Semiconductor Industry

MEMS Technology Status and Development Prospects