Advances on thermal conductive epoxy‐based composites as electronic packaging underfill materials – A review
Yingfeng Wen,Chao Chen,Yunsheng Ye,Zhigang Xue,Hongyuan Liu,Xingping Zhou,Yun Zhang,Dequn Li,Xiaolin Xie,Yiu‐Wing Mai
DOI: https://doi.org/10.1002/adma.202201023
IF: 29.4
2022-05-19
Advanced Materials
Abstract:The integrated circuits (ICs) industry has been continuously producing micro‐electronic components with ever higher integration level, packaging density and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy‐based underfills are often employed in flip‐chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next‐generation IC chips with much higher power density. Despite many strategies have been proposed to improve the thermal conductivity of epoxy, its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal‐electrical‐mechanical‐processing properties of underfill materials for flip‐chip packaging remains a great challenge. Herein, we review state‐of‐the‐art advances that have been made to satisfy the key requirements of capillary underfill materials. Based on these studies, we provide the perspectives for designing high‐performance underfill materials with novel microstructures in electronic packaging for high‐power density electronic devices. This article is protected by copyright. All rights reserved
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology