The Research Status and Development Trends of System in Package(SiP) Technology

Hu Yang,Cai Jian,Cao Liqiang,Chen Lingzhi,Liu Ziyu,Shi Lulu,Wang Qian
DOI: https://doi.org/10.3969/j.issn.1004-4507.2012.11.001
2012-01-01
Abstract:System in Package(SiP) has become one of the most important advanced assembly and integrated technology.It is important technology roadmap of miniaturization and multi-function of electronic products in future.SiP has wide market in application and prospective development of microelectronics and electronics manufacture.This article is a brief description of current status and development trend of SiP technology.Especially this article focus on the research and development on SiP technology by international semiconductor industry and main institutes.Furthermore there is brief review and prospective on SiP technology development in our country.
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