The Morphology and Rectangular Resistance of Films Formation by Cu Cluster Beam Collided with and Deposited Onto Si Substrate

李公平,何山虎,丁宝卫,张小东,丁印锋,包良满,刘正民,朱德彰
DOI: https://doi.org/10.3321/j.issn:0455-2059.2004.05.009
2004-01-01
Abstract:Cu_n~- (n is the atome number of the cluster) cluster beam was produced by a new magnetron sputter gas aggregation cluster source. The beam was accelerated by the voltage 0, 1, 3, 5, 10kV and deposited onto polished P-Si(111)substrate surface at room temperature in Vacuum and then the thin film samples of Cu/P-Si(111) were prepared. AFM analysis shows: for film deposited by the new cluster source when the accelerated voltage was more than 3 kV, the coarseness of the surface of it is less than that of the film deposited by the ordinary magnetron sputter and decreased with the increase of voltage. And it also shows, by measurement of the rectangular resistance of the film using four defecting needles and after normalization, that the rectangular resistance of the film produced by the new cluster source, when the accelerated voltage was less than 3 kV(V_α≤3 kV), is greater than that of film produced by the ordinary magnetron sputter, whereas when the accelerated voltage was more than 5 kV(V_α≥5 kV), the result is on the contrary and then the rectangular resistance of the cluster beam deposition film decreased with the increase of the biased voltage V_α.
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