Effects of Ethylenediamine in Copper Brush Plating Solution

费敬银,辛文利,梁国正,马晓燕,朱光明
DOI: https://doi.org/10.3969/j.issn.1001-3660.2003.05.012
2003-01-01
Surface Technology
Abstract:The effects of C2N2H8 on the properties of copper brush plating solution and copper deposits are investigated in the present paper. The results obtained show that the ratio of is a key parameter which determines the performances of bath solution and the deposit. The optimized ratio range of C2N2H8/ is (2~3)/L. The depositing rate of copper brush plating solution made from Cu(CH3SO3)2 is much higher than that from CuSO5O4.
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