Nickel electrodeposition from deep eutectic solvents containing copper ions at a high temperature
Gharib Qadr,M.I. Awad,M.I. Awad,Khozan Haji,Jamil Abdulla Jumaa,Hassan H. Abdallah
DOI: https://doi.org/10.1016/j.molliq.2023.121584
IF: 6
2023-05-15
Journal of Molecular Liquids
Abstract:In the current study, the electrodeposition of nickel in the presence of various concentrations of copper ions was studied in a eutectic-based ionic liquid, i.e., 1:2 choline chloride (ChCl):ethylene glycol (EG), which is called Ethaline, at 90 °C. The electrodeposition process was conducted in the presence of additional additives such as nicotinic and boric acids. The electrolyte solution was characterized using a conductivity test and UV–vis analysis. The electrodeposition process is highlighted using cyclic voltammetry (CV) and chronocoulometry (CC). The deposited nickel was subjected to a hardness test and different X-ray techniques, such as SEM, XRD and EDX analysis. The effect of the copper ion concentration on the quality of the electrodeposit was highlighted. It was found that the electrodeposition of nickel from the eutectic-based ionic liquid in the presence of copper ions improved the surface quality, minimized roughness, and promoted consistent surface morphology. The significant difference in the deposit morphology is discussed in the context of metal speciation and mass transport differences between the aqueous and ionic liquids.
chemistry, physical,physics, atomic, molecular & chemical