Novel Absorber Membrane and Thermocouple Designs for CMOS-MEMS Thermoelectric Infrared Sensor

Kai-Chieh Chang,Ya-Chu Lee,Chih-Ming Sun,Weileun Fang
DOI: https://doi.org/10.1109/memsys.2017.7863638
2017-01-01
Abstract:This study designs and implements a thermoelectric IR sensor using TSMC 0.35μm 2P4M standard CMOS process. The novel design has three major concerns: heat conduction of the absorber membrane, distribution of the thermocouple, and etching release holes for post-CMOS process. Proposed design significantly increase the thermal resistance and responsivity of IR sensor. As compare with the reference design, the presented design could increase the responsivity for 6-fold at 25mtorr working pressure.
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