Low Defect Density Bulk Aln Substrates for High Performance Electronics and Optoelectronics

Balaji Raghothamachar,Rafael Dalmau,Baxter Moody,Spalding Craft,Raoul Schlesser,Jinqiao Xie,Ramon Collazo,Michael Dudley,Zlatko Sitar
DOI: https://doi.org/10.4028/www.scientific.net/msf.717-720.1287
2012-01-01
Materials Science Forum
Abstract:Using the physical vapor transport (PVT) method, single crystal boules of AlN have been grown and wafers sliced from them have been characterized by synchrotron white beam X-ray topography (SWBXT) in conjunction with optical microscopy. X-ray topographs reveal that the wafers contain dislocations that are inhomogeneously distributed with densities varying from as low as 0 cm-2 to as high as 104 cm-2. Two types of dislocations have been identified: basal plane dislocations and threading dislocations, both having Burgers vectors of type 1/3<112-0> indicating that their origin is likely due to post-growth deformation. In some cases, the dislocations are arranged in low angle grain boundaries. However, large areas of the wafers are nearly dislocation-free and section X-ray topographs of these regions reveal the high crystalline perfection.
What problem does this paper attempt to address?