Abstract:The samples of commercial pure copper bars were severely plastic-deformed by different pretension and subsequently by different turns of torsion. Microstructure evolution of deformed samples was characterized using optical microscopy (OM). Longitudinal observations showed the formation of gradient microstructure with the maximum grain refinement in the surface layer of bars. Microindentation tests were conducted in the indenter load range of 100–450mN and at a loading rate of 9.6841mN/s. The hardness and Young's modulus were analyzed in the transversal section of samples using the method of Oliver and Pharr. Based on the strain gradient plasticity theory, the densities of statistically stored dislocations (SSDs) and geometrically necessary dislocations (GNDs) were calculated according to the Taylor dislocation model, respectively. Experimental results reveal that the hardness and Young's modulus decrease with the indenter load increasing. Indentation size effect on the hardness is relatively more significant than the counterpart of Young's modulus. In a certain pretension condition, the hardness values increase fast and subsequently slowly with the increase of applied torsion turns. The torsion process seems to effectively increase the material hardening due to the introduced simple shear strain. Compared to the hardness analysis, Young's modulus gently increases with the increase of torsion turns. That is due to the saturation of mechanical damage and/or crack introduced by severe deformation. In the combined tension–torsion loading, both densities of GNDs and SSDs increase with the increase of torsion turns. However, the SSDs density is higher than that of GNDs in spite of the same order magnitude. The torsional shear strain enhances the non-uniform deformation and stimulates the propagation of GNDs.

Micro-structural Evolution Subjected to Combined Tension–torsion Deformation for Pure Copper

Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper under Torsional Deformation

The Meso-inhomogeneous Deformation of Pure Copper under Tension–Compression Cyclic Strain Loading

Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsion deformation

Effect of Torsional Deformation on Microstructure and Mechanical Properties of Pure Copper

Influence of Deformation Stress Triaxiality on Microstructure and Microhardness of Pure Copper Processed by Simultaneous Torsion and Tension

Experimental Microindentation of Pure Copper Subjected to Severe Plastic Deformation by Combined Tension–torsion

Experimental Study on Pure Copper Subjected to Different Severe Plastic Deformation Modes

Study on tensile fracture of pure copper plate with a center hole

Microstructural Evolution and Micro‐Compression in High‐Purity Copper Processed by High‐Pressure Torsion

Experimental and numerical study on the micro-forming of copper multi-crystal

Effect of Strain Reversal on Microstructure and Mechanical Properties of Ti-6Al-4V Alloy under Cyclic Torsion Deformation

Effects of Torsional Deformation on the Mechanical Properties and Microstructures of a Commercial Pure Copper

Microstructures and Mechanical Properties of Commercial Hot‐Extruded Copper Processed by Torsion Deformation

Incremental strain gradient plasticity model and torsion simulation of copper micro-wires

Enhancing tensile strength of Cu by introducing gradient microstructures via a simple torsion deformation

Micro-structural Evolution in Metals Subjected to Simple Shear by a Particular Severe Plastic Deformation Method

Microstructural Evolution in Adiabatic Shear Bands of Copper at High Strain Rates: Electron Backscatter Diffraction Characterization

Ultrafine-grained Pure Copper Fabricated by Severe Plastic Deformation of Combined Tensile and Torsion

Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Effect of Torsional Rate on the Gradient Microstructure, Texture Evolutions and Microhardness of Pure Copper