Abstract:Microelectromechanical systems (MEMS) that feature components with the same geometrical size as that of an individual grain have been widely used in a variety of industries, including electronics, machinery, energy, transportation, aerospace, and architecture. Owing to the widespread engineering application of MEMS and nanoelectromechanical system devices, including sensors and actuators, submicron scale crystal materials exhibit mechanical behaviors different from those of macroscale materials, such as size effect, intermittent plastic flow, and strain rate effect, that have become significant topics in mechanics and materials research in recent years. Since dislocations are the carriers of plastic deformation, understanding the dislocation mechanism of submicron crystalline materials is crucial for designing and predicting microdevice reliability. To improve the understanding of abnormal mechanical behavior and dynamic deformation of submicron scale crystal components in processing and application, a two-dimensional discrete dislocation dynamics model of single crystal copper for plastic deformation was established based on the discrete dislocation dynamics theory. The effects of applied load, dislocation interactions, and image force by the free surface on dislocations were all considered in the numerical model, and the cutoff weighted dislocation velocity was also introduced. The model can be used to describe the “dislocation avalanche” effect under stress-controlled modes and interpret the dislocation evolution and mechanical behavior under different loading modes and strain rates, as demonstrated by microcompression experiments. When the external loading modes are force control and displacement control, the stress–strain curves show a step-like character under strain and a sharply serrated character under stress, respectively. The randomization of the dislocation velocity and intermittent activation of dislocation sources are the internal mechanisms of the dislocation avalanche effect. The strain rate sensitivity of the yield stress for single crystal copper changes in the strain rate range of 102–4 × 104 s−1. The evolution characteristics of the dislocations change from single slip plane to uniform deformations induced by multiple slip planes activation, and the dominant mechanism for the strain rate effect of yield stress is dislocation multiplication rather than dislocation source activation.

The Meso-inhomogeneous Deformation of Pure Copper under Tension–Compression Cyclic Strain Loading

Inhomogeneous Deformation Growth of a Metal under Cyclic Loading and Its Influence on Fatigue

Anisotropy of Yielding/Hardening and Micro-Inhomogeneity of Deforming/Rotating for A Polycrystalline Metal under Cyclic Tension Compression

Grain-level Statistical Plasticity Analysis on Strain Cycle Fatigue of a FCC Metal

Study on tensile fracture of pure copper plate with a center hole

CRYSTAL PLASTICITY NUMERICAL ANALYSIS ON YIELD AND SUBSEQUENT YIELD OF POLYCRYS-TALLINE COPPER UNDER COMBINED TENSION--TORSION LOADING

Mechanical Behaviour and the Evolution of the Dislocation Structure of Copper Polycrystal Deformed under Fatigue–tension and Tension–fatigue Sequential Strain Paths

Constitutive Modeling of Slip, Twinning and Detwinning for Mg Alloy and Inhomogeneous Evolution of Microstructure

Analysis of Slip-Band on Specimen Surface of Polycrystalline Copper under Tension

Analysis of Meso-Inhomogeneous Deformation on a Metal Material Surface under Low-Cycle Fatigue

4223 - ANALYSIS ON CYCLIC PLASTICITY AND STRESS DISTRIBUTION OF POLYCRYSTAL AT GRAIN LEVEL

Micro-structural Evolution Subjected to Combined Tension–torsion Deformation for Pure Copper

Study of Slip-band of Crystalline Grains on the Surface of Polycrystalline Tensile Specimen

The mechanical response of commercially pure copper under multiaxial loading at low and high strain rates

On the Study of Cyclic Crystal Plasticity Ratchetting Constitutive Model for Polycrystalline Pure Copper

An investigation of slip transmission during uniaxial tensile deformation of a coarse-grained copper via EBSD characterization and crystal plasticity modelling

A mesoscale investigation of strain rate effect on dynamic deformation of single-crystal copper

Comprehensive Study of Plastic Deformation Mechanism of Polycrystalline Copper Using Crystal Plasticity Finite Element

Investigation of the Plastic Deformation of Single Crystal Copper Using a Two-Dimensional Discrete Dislocation Dynamics Model

Cyclic Stress-Strain Response Of A Copper Tricrystal And Bicrystal

Size Effect on Cyclic Torsion of Micro-Polycrystalline Copper Considering Geometrically Necessary Dislocation and Strain Gradient