Ni-Zn Ferrite-Powder-Mixed-Photoresist Coated On-Chip RF Inductor

YANG Chen,LIU Feng,REN Tian-ling,LIU Li-tian,Albert Wang,YUE Zhen-xing

DOI: https://doi.org/10.3969/j.issn.1004-1699.2008.02.032

2008-01-01

Abstract:On-chip RF inductors with integrated Ni-Zn ferrite films using a novel nano-powder-mixed-photoresist coating technique is reported. Well synthesized nano-size Ni0.3Zn0.6Cu0.1Fe2O4 powders are mixed into photoresist and then coated on top of RF inductor spirals for performance improvement. This new low-temperature fabrication method is developed to eliminate any damage introduced by conventional high temperature process (600°C) used in fabricating ferrite-integrated RF IC inductors. Measurement results show that, compared with air-cored inductor, the inductance(L) of ferrite film inductors increases by 14~27% across 0.1~4 GHz range. This work demonstrates a promising way to fabricate ferrite-integrated high-performance on-chip RF inductors in IC technology.