Abstract:We report the design and analysis of the first vertical magnetic-cored inductors in CMOS backend for radio-frequency (RF) ICs, which includes theoretical and experimental studies of device architecture, equivalent circuit model with parameter extraction technique, process development, and device characterization. Vertical magnetic cores with multiple-layer stacked-spiral structures are designed to realize compact inductive devices in RF ICs. A CMOS-compatible post-CMOS backend process module (CMOS +) and optimized high-permeability nanoparticles are utilized to achieve a high inductance-to-coil-area ratio (L-density) in gigahertz range. The prototype six-layer inductors with NiZnCu ferrite nanoparticles-magnetic-core were fabricated in a commercial foundry 0.18-μm six-metal RF CMOS technology. A high L-density of over 700 nH/mm2 to multigigahertz was obtained, with an 80% chip size reduction from the reference planar magnetic inductors. An equivalent circuit model with parameter extraction technique is developed to analyze magnetic enhancement effects. This work demonstrates the potential of design and integration of compact high-performance vertical magnetic-cored inductive devices into CMOS backend for high-quality and low-cost RF systems-on-a-chip.

INTEGRATED STACKED-SPIRAL RF INDUCTOR WITH NANOPOWDER MAGNETIC CORE

Stacked-Spiral RF Inductor With Vertical Nano-Powder Magnetic Core in CMOS

Stacked-spiral RF inductors with vertical nanoparticle magnetic core for radio-frequency integrated circuits in CMOS

Nano-powder-magnetic-core vertically stacked-spiral RF inductor in CMOS

Stacked-spiral RF inductors with vertical nano-particle-magnetic-medium

Stacked-spiral RF inductors with fully-filled vertical nanoparticle magnetic core

Stacked Spiral Inductor Design and Modeling for Fully-Integrated DC-DC Converters

A Study of On-Chip Stacked Multiloop Spiral Inductors

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Design and Analysis of Vertical Nanoparticles-Magnetic-Cored Inductors for RF ICs

Magnetic-Particle-Composite-Medium-Filled Stacked-Spiral Inductors for Radio-Frequency CMOS Applications

Implementation of New CMOS Differential Stacked Spiral Inductor for VCO Design

Vertical Topologies of Miniature Multispiral Stacked Inductors

A Novel Compact Model for On-Chip Vertically-Coiled Spiral Inductors

Design And Simulation Of On-Chip Magnetic Inductors For Rf Ics

On-chip soft-ferrite-integrated inductors for RF IC

Ni-Zn Ferrite-Powder-Mixed-Photoresist Coated On-Chip RF Inductor

Ferrite-Partially-Filled On-Chip RF Inductor Fabricated Using Low-Temperature Nano-Powder-Mixed-Photoresist Filling Technique for Standard CMOS

Ferrite-integrated On-Chip RF Solenoid Inductor

Thin Film Magnetic Core Microinductor with Stacked Windings

MEMS-based Fabrication of High-Performance Inductors with Back Hollow Structure and Ferromagnetic Film