Abstract:With the current explosive growth of communication technologies and a wide variety of applications being found for broadband and high frequency of electronic components, LTCC (Low Temperature Cofired Ceramics and Ferrites) with materials that possess special characteristics have been rapidly developed, due to its greater multifunctionality, higher performances, sub-miniaturization and excellent reliability. As one of the most important passive components, the chip inductor with high inductances used in high frequency has attracted significant interests in 3-D miniaturized systems. This paper focuses on the design and fabrication of a chip inductor based on the ZnTi-substituted hexaferrite BaFe12O19 by LTCC technology to realize the 0805 size of standard packaging for high frequency applications. Testing results show that the value of inductor is 2.45uH and cut-off frequency is 548MHz. And the measured results agree with the simulated data basically, which indicates that the samples can satisfy the need of high frequency inductors. The influences of each factor on the performances of inductor are also analyzed. It is an effective method to resolve the consistency problems between simulation and manufacture.

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On-Chip Integrated Inductors with Ferrite Thin-Films for RF IC

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Fully Integrated Ferrite-Based Inductors for Rf Ics

Ferrite-Integrated On-Chip Inductors for Rf Ics

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Ni-Zn Ferrite-Powder-Mixed-Photoresist Coated On-Chip RF Inductor

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Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

Investigation of On-Chip Soft-Ferrite-Integrated Inductors for Rf Ics-Part Ii: Experiments

Ferrite-Partially-Filled On-Chip RF Inductor Fabricated Using Low-Temperature Nano-Powder-Mixed-Photoresist Filling Technique for Standard CMOS

Design and Simulation of On-Chip RF Magnetic Medium Inductors

Ferrite-integrated On-Chip RF Solenoid Inductor

MEMS-based Fabrication of High-Performance Inductors with Back Hollow Structure and Ferromagnetic Film

High-frequency Micro-Inductor Fabricated on NiCuZn Ferrite Substrates

Equivalent Circuit Analysis of an RF Integrated Inductor with Ferrite Thin-Film