Abstract:In this paper, a dual-beam laser micromachining system consisting of a femtosecond (fs) laser and a nanosecond (ns) laser has been developed to enhance the ablation efficiency. Experiments were conducted in different materials including dielectric (fused silica), semiconductor (silicon wafer), and metal (aluminum alloys). The amount of material being removed was determined for fs pulses alone, ns pulses alone, and pairs of fs and ns pulses with different time lags in between. It was found that the material removal efficiency increases in the dual-beam process for all materials being studied as compared to the fs alone or ns alone, particularly for dielectrics. The highest ablation efficiency for fused silica occurs when the fs pulse is shot near the peak of the ns pulse envelope. A corresponding numerical model for dual beam ablation of dielectrics was also developed by integrating the plasma model, the improved two-temperature model, and Fourier's law to understand the laser-material interaction. It was found that the fs laser pulse can significantly increase the free electron density and change the optical properties of the dielectric, leading to the increase of absorption for the subsequent ns pulse energy. This study provides a fundamental understanding for the enhancement of material ablation efficiency, particularly for wide-bandgap dielectrics.

Ethanol-assisted Ablation of Silicon and Germanium by Temporally Shaped Femtosecond Pulses

Ablation Area Quasiperiodic Oscillations in Semiconductors with Femtosecond Laser Double-Pulse Delay.

Single-crystal silicon ablation with temporally delayed femtosecond laser double-pulse trains

Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

Production Rate Enhancement of Size-Tunable Silicon Nanoparticles by Temporally Shaping Femtosecond Laser Pulses in Ethanol.

A Study on Ablation Quality of Silicon by Femtosecond Laser Pulse Trains

Effects of Parameters in Femtosecond Laser Micromachining on Ablation of Silicon

Dynamics and its modulation of laser-induced plasma and shockwave in femtosecond double-pulse ablation of silicon

Femtosecond laser induced ablation of crystalline silicon upon double beam irradiation

Efficiency of silicon micromachining by femtosecond laser pulses in ambient air

Femtosecond Laser Ablation of Silicon in Air and Vacuum

Enhancement of Ablation Efficiency by a Femto/nano-Second Dual-Beam Micromachining System

Modeling the Femtosecond Laser Pulse-Train Ablation of Dielectrics

Structure-Mediated Excitation of Air Plasma and Silicon Plasma Expansion in Femtosecond Laser Pulses Ablation

Asymmetric Femtosecond Laser Ablation of Silicon Surface Governed by the Evolution of Surface Nanostructures

Influence of liquid environments on femtosecond laser ablation of silicon

Ablation Enhancement of Fused Silica Glass by Femtosecond Laser Double-Pulse Bessel Beam

Doping Effects on Ablation Enhancement in Femtosecond Laser Irradiation of Silicon

The Evolution of Ablation Area Induced by Femtosecond Laser

Femtosecond Laser Double Pulses Nanofabrication on Silicon

Observation of Femtosecond Laser-Induced Ablation in Crystalline Silicon