Abstract:Context: At the interface of W-Cu after direct jointing, diffusion layers with a thickness of approximately 22 nm are present but often overlooked in simulations of mechanical properties. In this study, an interface model with a W-Cu diffusion layer is developed using molecular dynamics (MD). The effects of the diffusion layers on the elastic-plastic behaviors, dissipation mechanisms, and fracture properties of the interface are analyzed under mode-I (perpendicular to the interface) and mode-II (parallel to the interface). The results demonstrate that the interface model with a diffusion layer exhibits superior mechanical properties under mode-I and mode-II loading compared to the model without a diffusion layer. Furthermore, a multi-scale method based on the classical Paris law is proposed, combining MD and finite element methods to investigate the fatigue crack propagation of W-Cu bimetallic composites under cyclic loading and predict their fatigue life. The findings of this study are meaningful for improving the mechanical properties of W-Cu interface materials, predicting the material's lifespan, and guiding related engineering applications. Methods: In this study, the molecular dynamics simulations have been carried out by using the Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS). The visualization of results is performed using the Open Visualization Tool (OVITO). Common neighbor analysis (CNA) and dislocation analysis (DXA) in OVITO have been employed to capture the structural evolution. Finite element method simulations are performed in Ansys Workbench.

Fracture Behavior of Cu/Cu–WCP Layered Composites

Experimental Investigation of Tensile Properties and Fracture Mechanism of WCP/Cu Composites Reinforced with Different WCP Volume Fraction

Role of Interfacial Transition Zones in the Fracture of Cu/V Nanolamellar Multilayers

Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Insight into the Microstructure and Tensile Behavior of the W–Cu Composite Reinforced with Tungsten Fibers and Particulates

Research on dynamic mechanical behavior and damage evolution mechanism of Cu/WCp laminated composites

Investigation for the Fracture Process of WCp/Cu Functionally Graded Materials under Three-Point-Bending

Microstructure and Thermal Property of W/cu Multilayer Composites

Strengthening Mechanisms and Research Progress in the W/Cu Interfaces

Numerical investigations on the hybrid effect and deformation mechanism of TiB2p and TiBw reinforced Cu composites prepared by in-situ mixing casting

Fracture behaviour, microstructure, and performance of various layered-structured Al2O3-TiC-WC-Co composites

Texture characteristics and tensile deformation behavior of Cu/Al layered composites prepared by cast-rolling method

Microstructure and Failure Mechanism of Y2O3 Coating on the W Fiber in Wf/W Composites During Field Assisted Sintering

Multilayered W-Cu composites with enhanced strength, electrical conductivity and wear resistance

Research on damage evolution mechanisms under compressive and tensile tests of plain weave SiC f /SiC composites using in situ X-ray CT

Frictional Sliding of Microcracks under Compression

Temperature dependent tensile and fracture behaviors of Mo-10 wt.% Cu composite

Micro-Mechanical Fracture Investigations on Grain Size Tailored Tungsten-Copper Nanocomposites

Multi-scale simulations of the mechanical behaviors of the W-Cu joint interface with a diffusion layer

Microstructure and properties of W Cu composites reinforced by in-situ generated WC

Thermal shock behaviors of W/Cu joints with different structures