Timing resolution performance of Timepix4 bump-bonded assemblies
Riccardo Bolzonella,Jerome Alexandre Alozy,Rafael Ballabriga,Martin van Beuzekom,Nicolò Vladi Biesuz,Michael Campbell,Paolo Cardarelli,Viola Cavallini,Victor Coco,Angelo Cotta Ramusino,Massimiliano Fiorini,Vladimir Gromov,Marco Guarise,Xavier Llopart Cudie,Shinichi Okamura,Gabriele Romolini,Alessandro Saputi,Arseniy Vitkovskiy
2024-07-10
Abstract:The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels.
Instrumentation and Detectors