Key Concepts Behind Forming-Free Resistive Switching Incorporated with Rectifying Transport Properties

Yao Shuai,Xin Ou,Wenbo Luo,Arndt Mücklich,Danilo Bürger,Shengqiang Zhou,Chuangui Wu,Yuanfu Chen,Wanli Zhang,Manfred Helm,Thomas Mikolajick,Oliver G. Schmidt,Heidemarie Schmidt
DOI: https://doi.org/10.1038/srep02208
IF: 4.6
2013-01-01
Scientific Reports
Abstract:This work reports the effect of Ti diffusion on the bipolar resistive switching in Au/BiFeO 3 /Pt/Ti capacitor-like structures. Polycrystalline BiFeO 3 thin films are deposited by pulsed laser deposition at different temperatures on Pt/Ti/SiO 2 /Si substrates. From the energy filtered transmission electron microscopy and Rutherford backscattering spectrometry it is observed that Ti diffusion occurs if the deposition temperature is above 600°C. The current-voltage (I–V) curves indicate that resistive switching can only be achieved in Au/BiFeO 3 /Pt/Ti capacitor-like structures where this Ti diffusion occurs. The effect of Ti diffusion is confirmed by the BiFeO 3 thin films deposited on Pt/sapphire and Pt/Ti/sapphire substrates. The resistive switching needs no electroforming process and is incorporated with rectifying properties which is potentially useful to suppress the sneak current in a crossbar architecture. Those specific features open a promising alternative concept for nonvolatile memory devices as well as for other memristive devices like synapses in neuromorphic circuits.
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