Atmospheric-pressure Cold Plasma for One-Step Deposition of TiO2 Photocatalytic Films

Li, Xiao-Song,Chang, Da-Lei,Di, Lan-Bo,Zhu, Ai-Min
DOI: https://doi.org/10.1109/plasma.2012.6383474
2012-01-01
Abstract:Summary form only given. Titanium dioxide (TiO2) films, because of their special properties, have been studied extensively as semiconductor photocatalyst for solar energy conversion and purification of water and air. Plasma CVD is highly efficient for depositing TiO2 films, but it has mainly been low pressure incorporated with sophisticated discharge and vacuum systems that have been adopted. Thus, in recent years, atmospheric-pressure cold plasma has been explored to deposite TiO2 films1–4. In this paper, RF and kilohertz dielectric barrier discharge (DBD) plasma were explored for one-step deposition of TiO2 photocatalytic films, respectively.
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