Abstract:As technology scales, power supply noise caused by core logic switching becomes critical. Shorter signal rise edge, high integration density, and necessity of using on-chip decoupling capacitors require that the on-chip power distribution should be modeled as an LRC transmission line network with millions of switching devices. In this paper, we propose a sophisticated power grid model consisting of distributed LRC elements excited by constant voltage sources and switching capacitors. Based on this, fast equations for core switching noise estimations were formulated. Full-chip noise distribution on the power grid with any topology was efficiently and accurately computed. SPICE simulations confirmed its efficiency and accuracy. Experimental results obtained on our benchmark circuits revealed that the proposed technique speeded up simulations by several orders of magnitude compared with SPICE, whereas typical relative error was between 0 +/- 5 %. By integrating a packaging model, the new model predicts accurately the upper boundaries of noise level for power bounce, ground bounce, and differential-mode power noise. Meanwhile, locations of hot spots in the power network are precisely identified. The model is suitable for full-chip rapid simulations for on-chip power distribution design in advanced ultra large scale integration (ULSI) circuits, particularly for early stage analysis, in which global and local optimization such as topology selection, power bus sizing, and on-chip decoupling capacitor placement can be easily conducted.

Power Distribution TSVs Induced Core Switching Noise

Power Integrity Analysis of TSV Based 3-D Integrated Circuits

Modeling of peak-to-peak switching noise along a vertical chain of power distribution TSV pairs in a 3D stack of ICs interconnected through TSVs

Modeling of Peak-to-peak Core Switching Noise, Output Impedance, and Decoupling Capacitance along a Vertical Chain of Power Distribution TSV Pairs

Peak-To-Peak Ground Noise on A Power Distribution Tsv Pair As A Function of Rise Time in 3-D Stack of Dies Interconnected Through Tsvs

Modeling of Power Distribution Network Based on Multi-Walled Carbon Nanotube TSVs for 3-D ICs

A Multicore Chip Load Model for PDN Analysis Considering Voltage–Current-Timing Interdependency and Operation Mode Transitions

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Systematic Analysis for Static and Dynamic Drops in Power Supply Grids of 3-D Integrated Circuits

Power Integrity Optimization of 3d Chips Stacked Through Tsvs

Power Integrity Modeling, Measurement and Analysis of Seven-Chip Stack for TSV-based 3D IC Integration

TSV inductor optimization and its design implication

Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair

Silicon-Validated Power Delivery Modeling and Analysis on a 32-Nm DDR I/O Interface.

Impact of Supply Noise on Nano-Meter VLSI Design: Hard or Soft Threshold?

Novel LC resonant clocking for 3D IC using TSV-inductor and capacitor

Fast Modeling Of Core Switching Noise On Distributed Lrc Power Grid In Ulsi Circuits

Modeling and analysis of TSV noise coupling and suppression methods for 20nm node and beyond

Modeling and Impedance Analysis of Power Distribution Network in 3D ICs with TSVs

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

System-Level Analysis of 3D ICs with Thermal TSVs