Abstract:In this paper, high-frequency electrothermal characteristics of the power delivery network (PDN) are investigated for through-silicon-via (TSV)-based 3-D ICs by utilizing a self-developed electrothermal co-simulation solver. The solver circularly solves the full-wave electromagnetic equation and the steady heat conduction equation using the finite-element method. The preconditioned biconjugate gradient method combined with the element-by-element approximate factorization method is employed to speed up the simulation and save memory cost. Based on the solver, the impacts of the excitation condition and dielectric loss tangent are analyzed for a one-chip power grid, while the influence of TSV location is studied for a two-chip PDN structure. In the modeling, both the conductor and dielectric losses are taken into account, and the temperature dependence of material parameters is treated appropriately. As results, PDN impedance and self-heating-induced temperature rise are emphatically analyzed in a wide frequency range, and the electric field and temperature distributions of several resonance modes are presented. The results would be beneficial for the design and thermal management of 3-D PDNs.

Peak-To-Peak Ground Noise on A Power Distribution Tsv Pair As A Function of Rise Time in 3-D Stack of Dies Interconnected Through Tsvs

Power Integrity Analysis of TSV Based 3-D Integrated Circuits

Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair

Power Distribution TSVs Induced Core Switching Noise

Modeling of peak-to-peak switching noise along a vertical chain of power distribution TSV pairs in a 3D stack of ICs interconnected through TSVs

Modeling of Peak-to-peak Core Switching Noise, Output Impedance, and Decoupling Capacitance along a Vertical Chain of Power Distribution TSV Pairs

Systematic Analysis for Static and Dynamic Drops in Power Supply Grids of 3-D Integrated Circuits

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Dynamic Current Testing on Power Supply Noise

Modeling of Power Distribution Network Based on Multi-Walled Carbon Nanotube TSVs for 3-D ICs

Bursty Jitter In High-Speed I/O Due To Power-State Transition And Its Impact On Signal Integrity

Analysis of Rectangular Power-Ground Plane Pairs for Noise Suppression

In-package P/G Planes Analysis and Optimization Based on Transmission Matrix Method

Early-Stage Power Grid Design

Impact of Supply Noise on Nano-Meter VLSI Design: Hard or Soft Threshold?

Early-Stage Power Grid Design: Extraction, Modeling and Optimization

Power Integrity Optimization of 3d Chips Stacked Through Tsvs

Time Domain PDN Noise Modeling for High Performance System

Calculation of the Worst-Case Voltage Noise for a Power Distribution Network Based on Ramp Current

Modeling and Impedance Analysis of Power Distribution Network in 3D ICs with TSVs

Simulation and Analysis of P/G Noise in TSV Based 3D MPSoC