Abstract:The relentless pursuit of energy-efficient electronic devices necessitates advanced methodologies for low-power design verification, with a particular focus on mitigating power supply noise. The challenges posed by shrinking voltage margins in low-power designs lead to a significant demand for rapid and accurate power supply noise simulation and verification techniques. Too large supply noise inevitably results in the raise of supply level, thereby hurting the lower power design target. Spectral methods have demonstrated as a great alternative to produce a sparse sub-matrix with spectral-similarity property as the preconditioner to efficiently reduce the iteration number and solve the linear system for supply noise verification. However, existing methods either suffer from high computational complexity or rely on approximations to reduce computational time. Therefore, a novel approach is needed to efficiently generate high-quality preconditioners. In this paper, we propose a two-stage spectral-aware algorithm to address these challenges. Our approach has three main highlights. Firstly, by introducing spectral-aware weights, we can better assess the priority of edges and construct high-quality spanning trees with the minimum relative condition number. Secondly, by leveraging eigenvalue transformation strategies, we can quickly and accurately recover off-tree edges that are spectrally critical, avoiding time-consuming iterative computations. Thirdly, we proposed a fast computation method to further decrease the computational complexity of the effective resistance. Compared with two SOTA methods, GRASS and feGRASS, our approach demonstrates higher accuracy and efficiency in preconditioner generation (37.3x and 2.13x speedup, respectively) as well as significant improvements in accelerating the linear solver for power supply noise analysis in power grid simulation and other Laplacian graphs (5.16x and 1.70x speedup, respectively).

Modeling of peak-to-peak switching noise along a vertical chain of power distribution TSV pairs in a 3D stack of ICs interconnected through TSVs

Modeling of Peak-to-peak Core Switching Noise, Output Impedance, and Decoupling Capacitance along a Vertical Chain of Power Distribution TSV Pairs

Power Distribution TSVs Induced Core Switching Noise

A Silicon-Validated Methodology for Power Delivery Modeling and Simulation

Modeling of Power Distribution Network Based on Multi-Walled Carbon Nanotube TSVs for 3-D ICs

Power Integrity Modeling, Measurement and Analysis of Seven-Chip Stack for TSV-based 3D IC Integration

Silicon-Validated Power Delivery Modeling and Analysis on a 32-Nm DDR I/O Interface.

A Multicore Chip Load Model for PDN Analysis Considering Voltage–Current-Timing Interdependency and Operation Mode Transitions

Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair

Power Integrity Analysis of TSV Based 3-D Integrated Circuits

Peak-To-Peak Ground Noise on A Power Distribution Tsv Pair As A Function of Rise Time in 3-D Stack of Dies Interconnected Through Tsvs

Fast Modeling Of Core Switching Noise On Distributed Lrc Power Grid In Ulsi Circuits

Systematic Analysis for Static and Dynamic Drops in Power Supply Grids of 3-D Integrated Circuits

Methodology For Modeling Simultaneous Switching Noise In Bga Packaging

Efficient And Accurate Modeling Of Power Supply Noise On Distributed On-Chip Power Networks

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Efficient Spectral-Aware Power Supply Noise Analysis for Low-Power Design Verification

Modeling of the Simultaneous Switching Noise in High Speed Electronic Circuit with the Integral Equation Method and Vector Fitting Method

A New Method for Power-Aware Signal Integrity Analysis with Spice Model of Power Distribution Network

System-Level Analysis of 3D ICs with Thermal TSVs