Abstract:A novel in situ autoreduction route has been developed, by which monodispersed silver nanoparticles with tunable sizes could be easily fabricated on silica-based materials, especially inside the channels of mesoporous silica (MPS). 13C CP/MAS NMR spectroscopy was employed to monitor the whole assembly process. It was demonstrated that the amino groups of APTS (aminopropyltriethoxyl silane)-modified MPS can be used to anchor formaldehyde to form novel reducing species (NHCH2OH), on which Ag(NH3)2NO3 could be in situ reduced. Monodispersed silver nanoparticles were thus obtained. In situ XRD and in situ TEM experiments were used to investigate and compare the thermal stabilities of silver nanoparticles on the external surface of silica gels (unconfined) and those located inside the channels of SBA-15 (confined). It was observed that unconfined silver nanoparticles tended to agglomerate at low temperatures (i.e., lower than 773 K). The aggregation of silver nanoparticles became more serious at 773 K. However, for those confined silver nanoparticles, no coarsening process was observed at 773 K, much higher than its Tammann temperature (i.e., 617 K). Only when the treating temperature was higher than 873 K could the agglomeration of those confined silver nanoparticles happen with time-varying via the Ostwald ripening process. The confinement of mesopores played a key role in improving the thermal stabilities of silver nanoparticles (stable up to 773 K without any observable coarsening), which is essential to the further investigations on their chemical (e.g., catalytic) properties.

Large-Scale synthesis of silver nanoparticles by aqueous reduction for low-temperature sintering bonding

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Sonochemical synthesis of silver nanoparticles coated copper wire for low-temperature solid state bonding on silicon substrate

A Study on the Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Ag2o Microparticles

Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Preparation and Microstructure of Silver Nanopowder with Spheric Morphology

Synthesis and Low-Temperature Sintering of Tin-Doped Silver Nanoparticles

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Synthesis of monodispersed plate-shaped silver particles: with high tap-density and low radius-thickness ratio

Toward Monodispersed Silver Nanoparticles with Unusual Thermal Stability.

Effect of Pvp on the Low Temperature Bonding Process Using Polyol Prepared Ag Nanoparticle Paste for Electronic Packaging Application

Elucidation of the capillarity-promoted sintering of silver nanoparticles produced by a spark ablation vapor source

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste

Synthesis of nanosized silver particles by chemical reduction method

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

A Facile Synthetic Route to Aqueous Dispersions of Silver Nanoparticles