Abstract:A silicon machined high-performance monolithic triaxial piezoresistive accelerometer is developed for measurements on the order of 100, 000g. A three-beam-mass scheme with tiny beams is developed for the x and y axial elements, and a three-beam-twin-mass structure is developed for the z axial element. Both of these structures feature high sensitivity and high resonance frequency compared with a conventional cantilever structure or cantilever-mass structure. ANSYS is used to analyze and optically design the accelerometer. The three sensing elements are monolithically integrated by micromachining techniques of double-sided deep etching combined with piezoresistive processes. The middle structure silicon layer is anodic bonded with glass substrate and BCB bonded with a top cap silicon layer for the purpose of plastic packaging to improve the reliability of the accelerometer. A dropping-bar system is used to characterize the accelerometer. The sensitivities in the x, y, and z axes are measured to be 2.28, 2.36, and 2.52μV/g, respectively, while the corresponding resonant frequencies are 309, 302, and 156kHz. Using a Dongling shock test machine, the nonlinearity is tested by comparison calibration and measured to be 1.4% and 1.8% for the y and z axial elements, respectively.

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