Laser Bonding and Packaging of Plastic Microfluidic Chips
JJ Lai,XQ Chen,XF Wang,XJ Yi,S Liu
DOI: https://doi.org/10.1109/eptc.2003.1298717
2003-01-01
Abstract:Plastics-based microfluidic and other microanalytical platforms have a great potential in bioMEMS applications, because many plastics are low cost and biocompatible, and have good processibility, compared with silicon and/or glass based biochips. To achieve terminal product bonding and packaging is a challenging issue in the fabrication of these plastic platforms. Conventional bonding and packaging methods have aroused problems like high temperature, high voltage, vibration damage or adhesive pollution. In this paper. a new bonding technology based on transmission laser welding plastics is introduced to the field of plastics chips packaging. Principle, experimental set-up and initial result are given to show characteristics of this technology.
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