Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding.

Rui Guo,Liming Gao,Dali Mao,Ming Li,Xu Wang,Zhong Lv,Hope Chiu
DOI: https://doi.org/10.1016/j.microrel.2014.04.005
IF: 1.6
2014-01-01
Microelectronics Reliability
Abstract:•The EFO current was the key factor to influence the Ag–8Au–3Pd alloy FAB size and morphology.•Mechanisms of FAB defects including off-center and ripple formation were discussed by solidification process.•A medium flow rate was suitable for Ag–8Au–3Pd alloy FAB formation.•Under the protection of shielding gas, oxidation and sulfuration of the Ag–8Au–3Pd alloy FAB were effectively prevented.
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