Enhanced Thermal Conductivity Of Polycrystalline Aluminum Nitride Thin Films By Optimizing The Interface Structure
Taisong Pan,Ying Zhang,Jiang Huang,Baoqing Zeng,Deng Hong,S. L. Wang,Huizhong Zeng,Ming Gao,Wei Huang,Yuan Lin
DOI: https://doi.org/10.1063/1.4748048
IF: 2.877
2012-01-01
Journal of Applied Physics
Abstract:The growth-temperature dependency and interface structure effects on the thermal conductivity of the highly textured AlN thin films on (001) Si substrates were systematically studied by characterizing the crystal structures, surface morphologies, interface structures, chemical compositions, and thermal conductivity using x-ray diffraction analysis, atomic force microscopy, high resolution transmission electron microscopy, x-ray photoelectron spectroscopy, and 3-omega method, respectively. By optimizing the interface microstructure and the growth temperature, thermal conductivity of polycrystalline AlN thin films can be greatly enhanced from 9.9 to 26.7 W/mK, when the growth temperature increases from 330 to 560 degrees C. This achievement is considered to be associated with the diminishment of the amorphous and disordered layer at the AlN/Si interface. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4748048]