Properties Of Ferroelectric Thin Film Capacitor For Embedded Passive Applications

Ning Zhao,Lixi Wan,Shuhui Yu
DOI: https://doi.org/10.1109/ICEPT.2011.6066833
2011-01-01
Abstract:BaTiO3/Ba0.6Sr0.4TiO3/SrTiO3 (BT/BST/ST, as one periodic structure) multilayer thin films were deposited on Pt/Ti/SiO2/Si substrates by a sol-gel method. Platinum electrodes were then patterned on the films by sputtering and lithographic process to form metal-ferroelectric-metal (MFM) capacitors. The multilayer thin films were crack free, compact and crystallized in perovskite structure. The crystallization temperature was between 600 degrees C and 650 degrees C. The dielectric constant of the multilayer films was significantly higher than that of individual uniform films of BaTiO3, SrTiO3 or Ba0.6Sr0.4TiO3 of similar thickness. The multilayer thin films showed excellent dielectric and electric properties that make them promising candidates for the dielectric layer of embedded capacitor in package substrate in a discrete format. Within the entire test range of frequencies, the capacitance of all samples remained at the level of several nF. The breakdown voltage of the MFM capacitors was measured to be greater than 27 V.
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