Abstract:Electronically conductive adhesives (ECAs) are commonly used in IC and LED packaging. Copper (Cu) powders can be applied to ECAs as conductive filler. Micron-sized Cu powders has many excellent physical properties and catalytic activity. However, after the Cu powders has been microfined, it is easily oxidised to cuprous oxide in air due to the large specific surface area of the Cu particles and their high chemical activity. The silver-coated copper (Cu@Ag) powders is formed by Ag plating on the surface of the Cu powders, which not only improves the oxidation resistance of Cu, but also maintains the excellent electrical conductivity of Cu. During the replacement reaction, the dotted Ag is the positive electrode of the micro-battery, and the Cu that has not been replaced on the surface is the negative electrode. Ag ions can be reduced and deposited on Cu powder by chemical substitution reaction. Economically, Cu@Ag powders as filler can not only enhance the performance of ECAs but also reduce the cost of ECAs. The SEM image of Cu@Ag shows a high Ag content of 90 wt% on the surface of Cu as can be seen by the EDS spectrum. The oxidation of Cu powders can be effectively inhibited by plating Ag on Cu surface and play a great role in the oxidation resistance of Cu. Moreover, the application of Cu@Ag powders with different morphologies promoted the curing of ECAs. Under the optimal curing process, ECAs’ bulk resistivity was 21.27×10 -3 Ω•cm, 3.27×10 -3 Ω•cm, and the shear strength was 17.66 MPa, 12.24 MPa when adding 75 wt% spherical and flaky Cu@Ag powders, respectively. When filled with two different shapes of Cu@Ag powders, the ECA had a bulk resistivity of 1.75×10 -3 Ω•cm and a shear strength of 20.39 MPa. The better comprehensive performance of the bi-component ECAs was proved.

Study on Stabilizing Contact Resistance of Electrically Conductive Adhesives by In-Situ Replacement Method

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Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Electrical Property Improvement of Dicyandiamide-Cured Electrically Conductive Adhesives Through In-Situ Replacement by Difunctional Acids and the Impact on Storage

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Preparation of silver-coated copper powders and its application in conductive adhesives

Electrical Property of Electrically Conductive Adhesives Filled with Micro-Sized Ag Flakes and Modified by Dicarboxylic Acids

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Effects of Silver Nano-Particles and Nano-Wires on Properties of Electrically Conductive Adhesives

Electrically conductive adhesives with sintered silver nanowires

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

The Interaction Mechanism of Dicarboxylic Acids and Electrically Conductive Adhesives