Abstract:High-efficiency silicon solar cells rely on some form of passivating contact structure to reduce recombination losses at the crystalline silicon surface and losses at the metal/Si contact interface. One such structure is polycrystalline silicon (poly-Si) on oxide, where heavily doped poly-Si is deposited on a SiOx layer grown directly on the crystalline silicon (c-Si) wafer. Depending on the thickness of the SiOx layer, the charge carriers can cross this layer by tunneling (<2 nm SiOx thickness) or by direct conduction through disruptions in the SiOx, often referred to as pinholes, in thicker SiOx layers (>2 nm). In this work, we study structures with tunneling- or pinhole-like SiOx contacts grown on pyramidally textured c-Si wafers and expose variations in the SiOx layer properties related to surface morphology using electron-beam-induced current (EBIC) imaging. Using EBIC, we identify and mark regions with potential pinholes in the SiOx layer. We further perform high-resolution transmission electron microscopy on the same areas, thus allowing us to directly correlate locally enhanced carrier collection with variations in the structure of the SiOx layer. Our results show that the pinholes in the SiOx layer preferentially form in different locations based on the annealing conditions used to form the device. With greater understanding of these processes and by controlling the surface texture geometry, there is potential to control the size and spatial distribution of oxide disruptions in silicon solar cells with poly-Si on oxide-type contacts; usually, this is a random phenomenon on polished or planar surfaces. Such control will enable us to consistently produce high-efficiency devices with low recombination currents and low junction resistances using this contact structure.

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Collaborative R&D Between Multicrystalline Silicon Ingots and Battery Efficiency Improvement—effect of Shadow Area in Multicrystalline Silicon Ingots on Cell Efficiency

Constructing Submicron Textures on Mc-Si Solar Cells Via Copper-Catalyzed Chemical Etching

Improvement of conversion efficiency of multicrystalline silicon solar cells by incorporating reactive ion etching texturing

Research on Silicon Wafer Surface Phase under the Ultra-thin Slicing Process and Its Etching Hindrance Behavior during Metal-Assisted Chemical Etching

INFLUENCE OF SUB-SURFACE DAMAGE ON TEXTURING OF MONOCRYSTALLINE SILICON WAFERS FOR SOLAR CELLS

Effect of Additives on Making Texture Surface on Multicrystalline Silicon Wafer by Diamond Wire Sawing

A Metal-Free Additive Texturization Method Used for Diamond-Wire-sawn Multi-Crystalline Silicon Wafers

An Innovative Light Trapping Structure Fabrication Method on Diamond-Wire-Sawing Multi-Crystalline Silicon Wafers

Surface damage and metal-catalyzed chemical etching investigation of multicrystalline silicon by diamond wire sawing

Texturization of Cast Multicrystalline Silicon for Solar Cells

Aqueous HF-(HCl)-Cl2 Mixtures for Saw-Damage Removal and Spray Texturing of Monocrystalline Silicon Solar Cells

Effects of metal impurities at the edges of cast Si ingot on crystal quality and solar cell performance

Study on the influence of micro-alkali texturing and micro-alkali polishing process on the passivation and contact performance of n-TOPCon solar cells

Characterization of nanoporous silicon layer to reduce the optical losses of crystalline silicon solar cells

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UV-OZONE Treatment for Suppressing Surface Damages on Silicon Solar Cells

Effect of Surface Texture on Pinhole Formation in SiO x-Based Passivated Contacts for High-Performance Silicon Solar Cells

Over‐Lithiation Regulation of Silicon‐Based Anodes for High‐Energy Lithium‐Ion batteries

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

Metal-catalyzed chemical etching using DIO3 as a hole injection agent for efficient submicron-textured multicrystalline silicon solar cells