Abstract:Femtosecond laser processing technology is an advanced sub-micro-processing technique that enables the non-contact processing of various materials. This technology can be used to apply sub-micro structures for purposes such as hydrophilicity enhancement, optical transmittance improvement, and photonics detection. However, when it comes to processing micro/nanostructures on highly brittle materials using femtosecond lasers, there are challenges such as low processing efficiency, generation of debris, and microcracking. In this paper, we propose a method called the out-of-focus femtosecond laser direct writing technique combined with wet etching. This method offers simplicity, speed, and flexibility in preparing dense, large-area sub-microstructured surfaces on the brittle material sapphire. Our detailed investigation focuses on the impact of laser processing parameters (direct writing period, distance of focusing, direct writing speed, etc.) on the sub-microstructures of Al2O3 surfaces. The results demonstrate that this method successfully creates embedded sub-microstructures on the sapphire surface. The microholes, with a diameter of approximately 2.0 μm, contain sub-micro structures with a minimum width of 250 ± 20 nm. Additionally, we conducted experiments to assess the optical transmittance of sapphire nanostructures in the range of 350–1200 nm, which exhibited an average transmittance of approximately 77.0%. The water contact angle (CA) test yielded a result of 52 ± 2°, indicating an enhancement in the hydrophilicity of the sapphire nanostructures with only a slight reduction in optical transmittance. Our efficient fabrication of sub-microstructures on the sapphire surface of highly brittle materials offers a promising method for the production and application of brittle materials in the field of micro-optics.

Research of sapphire wafer scribing by using UV laser

Experimental Investigation on the Scribing of Sapphire Using Uv Laser

The Experimental Research of Sapphire Dicing by a UV Laser

Laser micro-structuring of sapphire wafer and fiber

Micromachining technology of sapphire substrate based on 157nm DUV laser

Material removal and surface formation mechanism of C-plane sapphire in multipass ablation by a nanosecond UV laser

Experimental Research on UV Laser and High-Pressure Water-Assisted YAG Laser Dicing SiC Wafer

Surface micro-texture on sapphire fabricated by laser ablation trajectory regulation

Controllable Laser Thermal Cleavage of Sapphire Wafers

A Method for Preparing Surface Sub-Microstructures on Sapphire Surfaces Using Femtosecond Laser Processing Technology

Investigation on sapphire ablation by femtosecond-nanosecond dual beam laser

Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

Research on sapphire micro-blind-hole machining based on femtosecond laser

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Sub-diffraction-limit fabrication of sapphire by femtosecond laser direct writing

Process Research on Micro-Machining Diamond Microgroove by Femtosecond Laser

A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

Femtosecond Laser Micro-Machining of Three-Dimensional Surface Profiles on Flat Single Crystal Sapphire

Experimental Study on the Influence of Ultraviolet Laser Parameters on the Microstructure Machining Quality of Silicon Carbide Ceramic

FEMTOSECOND LASER SCRIBING OF SAPPHIRE AT WAVELENGTH 1040 AND 520 NM

Fabrication of PCD Skiving Cutter by UV Nanosecond Laser