The Experimental Research of Sapphire Dicing by a UV Laser

Huang Huan,Yang Lijun,Wang Maolu,Wang Yang
DOI: https://doi.org/10.3969/j.issn.1009-279X.2009.05.009
2009-01-01
Abstract:The dicing of sapphire by UV laser is reported.Several microgrooves have been produced by varying Laser Pulse Repetition Frequency(PRF),incident laser fluence and scanning speed.The dicing quality,depth and width of microgrooves have been measured and investigated.The results show that the dicing quality of sapphire by UV laser is good,the incident laser fluence has large effect on the dicing quality,and the changes of incident laser fluence,PRF and scanning speed influence the dicing depth and width,the surface roughness of wafer has large effect on the dicing quality.
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