Failure Analysis of Cracked Die

Lili Ma,S. X. Bao

DOI: https://doi.org/10.1149/1.3360633

2010-01-01

Abstract:Aimed at crack die problem of micro-package, a series of experiments on failure components were conducted by using optical microscope, scanning electron microscope (SEM), Fein focus X-ray, cross section and various chemical etched methods. The failure analysis technique of cracked die in microelement was presented in detail, and the cause of these failure components was found finally. Wafer processing defect on the die has proven to be a contributing factor in the cracking of die. Mechanical damage acted as a stress riser from which the die crack may propagate. The root cause of die cracking in this failure was a consequence of the force inequality which came from mechanical loads in the package.