Failure Analysis On The Chip Capacitor

Wang Yang,He Wei,Mo Yunqi,Wang Shou-Xu,Wu Xiang-Hao,He Bo,Zhang Xuan-Dong

DOI: https://doi.org/10.1109/CAS-ICTD.2009.4960818

2009-01-01

Abstract:The analysis process and methods of a failure chip capacitor have been introduced by a failure analysis case for an actual chip capacitor with visual inspection, cross section analysis and SEM&EDS analysis. The analysis results show that the parallel resistance characteristic existed in chip capacitor is main cause for failure; The crack existed in ceramic dielectric materials between two electrodes of multilayer capacitor was arisen from chip capacitor manufacture obviously. The contribution of failure analysis to quality control of manufacturing process of semiconductor was also displayed.