Thick Glass High-Quality Cutting by Ultrafast Laser Bessel Beam Perforation-Assisted Separation
Suwan Chen,Yuxuan Luo,Xinhu Fan,Congyi Wu,Guojun Zhang,Yu Huang,Youmin Rong,Long Chen
DOI: https://doi.org/10.3390/mi15070854
2024-06-29
Abstract:The cutting of thick glass is extensively employed in aerospace, optical, and other fields. Although ultrafast laser Bessel beams are heavily used for glass cutting, the cutting thickness and cutting quality need to be further improved. In this research, the high-quality cutting of thick glass was realized for the first time using ultrafast laser perforation assisted by CO2 laser separation. Initially, an infrared picosecond laser Bessel beam was employed to ablate the soda-lime glass and generate a perforated structure. Subsequently, a CO2 laser was employed to induce crack propagation along the path of the perforated structure, resulting in the separation of the glass. This study investigates the influence of hole spacing, pulse energy, and the defocusing distance of the picosecond laser Bessel beam on the average surface roughness of the glass sample cutting surface. The optimal combination of cutting parameters for 6 mm thick glass results in a minimum surface roughness of 343 nm in the cross-section.