Abstract:The widespread use of sodium aluminosilicate glass in many engineering applications due to its mechanical and optical properties (transparency, dielectric, etc.), has become common in recent years. However, glass, a brittle material, has its vulnerability to fracture. Processes such as heat treatment (heat tempering) or chemical strengthening through ion-exchange have been used to create residual stress profiles on the glass, in a bid to improve its fracture strength. However, failure still occurs, which is mostly catastrophic and expensive to repair. Therefore understanding, predicting, and eventually improving the resistance to damage or fracture of chemically strengthened glass is important to designing new glasses that would be tougher while retaining their transparency. The relationship between the glass residual stress parameters such as the compressive stress (CS), depth of compression layer (DOL), and central tension (CT) versus apparent (effective) fracture toughness for different crack depth was investigated in this study using a Silicon Carbide particle blast plus ring-on-ring (RoR) test method. The results also showed that improving the fracture resistance of glass via chemical strengthening requires a proper combination of CS, DOL, and CT, which is particularly dependent on the initial/existing crack (flaw) depth. It was determined that for a damage event involving the introduction of a shallow crack depth, the criterion for optimal resistance to fracture, in terms of apparent fracture toughness, is weighted more towards a high CS, than deep DOL while for a deep flaw damage event, it is more weighted towards deep DOL, than a high CS. These results provide a valuable piece of information in the design of a more robust glass in engineering applications.

Effect of thermal stresses on chip-free diode laser cutting of glass

Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation

Thermal stress analysis on laser scribing of glass

Three-dimensional thermal stress analysis on laser scribing of glass

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

Tensile strength and crack tip stress distribution of modified glass in the composite laser beam separation

Crack arrest and stress dependence of laser-induced surface damage in fused-silica and borosilicate glass

Low-Temperature Gas Cooling Correction Trajectory Offset Technology of Laser-Induced Thermal Crack Propagation for Asymmetric Linear Cutting Glass

Energy-dependent correlation between micro/nano-morphology and stress state of femtosecond laser-induced modification in fused silica

The Competing Effect of Initial Crack Depth Versus Chemical Strengthening Parameters on Apparent Fracture Toughness of Sodium Aluminosilicate Glass

Thermal Stress Effects of the Diode-End-pumped Nd:YLF Slab

Stress-induced depolarization of Nd:glass in high-power laser amplifier

Damage morphology and mechanism in ablation cutting of thin glass sheets with picosecond pulsed lasers

Laser-induced stress by multi-beam femtosecond pulses in fused silica

Crack-Free Laser Processing Of Glass Substrate And Its Mechanisms

Mechanically inspired laser scribing of thin flexible glass

Effect of microstructure on thermal field distribution of absorption glass with nanosecond laser-irradiated

Distribution of Electric Field and Energy Flux Around the Cracks on the Surfaces of Nd-doped Phosphate Glasses.

Effect of Laser Parameters on Fracture Properties of Laser-Repaired Cracks with Micro/NanoMaterial Addition: Multiscale Analysis

Experimental investigation on thermal healing of subsurface damage in borosilicate glass

Effect of process parameters on crack characteristics in laser welding of Al2O3 ceramic