Abstract:The surface modification by ultra-fast laser could regulate the mechanical properties of hard and brittle materials. Since silicon carbide (SiC) is too hard to be machined with acceptable removal rate and quality by mechanical abrasives, and femtosecond laser (fs-laser) assisted grinding could be a potential method to improve the machinability of SiC. Under fs-laser modulating, SiC surface could be modified to generate laser-induced periodic surface structures (LIPSS). Understanding the mechanical properties and material removal mechanism of the LIPPS surface is crucial to accomplish a high efficiency and quality machining process. This paper aims to investigate the effects of fs-laser modification on the mechanical properties, removal mechanism, removal efficiency, and microstructure changes of 4H-SiC surface during removal, together with those of the original 4H-SiC surface for comparison. The hardness and elastic recovery ability of the modified layer are determined by nanoindentation test, and the nano-scratch test is adopted to study the materials removal behavior. The removal efficiency and the quality of the modified surface is significantly improved. Phase transformation is observed in the scratching area, which reveals the existence of ductile mode removal. Moreover, the stress distribution and the change of scratching force on the surface of SiC before and after modification are studied by finite element method (FEM). The results show that the stress distribution and transmission when scratched on the modified surface is lower than that of the original surface, and the scratching force under the same scratch conditions is greatly reduced. With the understanding of materials removal behavior from the whole process of deformation, phase transformation, and separation of LIPPS from substrate, then the fs-laser modification of SiC could be evidenced as an effective method to improve the grinding efficiency and quality in mass production of industry.

Ablation Threshold and Material Removal Mechanisms of SiC Processed by Femtosecond Laser

Experimental Investigation on Ablation of 4H-SiC by Infrared Femtosecond Laser

Ablation characteristics of femtosecond laser on wide band-gap ceramics

Femtosecond laser micromachining of SiC ceramic structures

Material Removal Effect of Microchannel Processing by Femtosecond Laser

Processing Microgrooves and Craters on the Surface of Wide Band Gap Mold Material Using Femtosecond Laser

Interaction Mechanism of Femtosecond Laser and Wide Band-Gap Material

Crystal Cleavage, Periodic Nanostructure And Surface Modification Of Sic Ablated By Femtosecond Laser In Different Media

Influence of surface morphology on processing of C/SiC composites via femtosecond laser

Investigations on the ablation behavior of C/SiC under femtosecond laser

Experimental and Simulation Research on Femtosecond Laser Induced Controllable Morphology of Monocrystalline SiC

Femtosecond Laser Modification of Silicon Carbide to Improve the Materials Removal Efficiency

Laser Ablation of 6H-Sic Single Crystals and Spectral Characterization

Study of Femtosecond Laser Ablation and Polishing Process on 4H-SiC Substrate

High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate

Microstructure evolution and ablation mechanism of SiCf/SiC ceramic matrix composite microgrooves processed by pico-second laser

Materials removal mechanism of single crystalline SiC with laser-induced periodic surface structures (LIPSS)

A Review of Femtosecond Laser Processing of Silicon Carbide

Femtosecond Laser Spiral Scanning Ablation of SiCf/SiC Composites

Microscopic Mechanisms of Ablation and Micromachining of Dielectrics by Using Femtosecond Lasers

Study of Femtosecond Laser Ablation Effect on Micro-Processing for 4H-SiC Substrate