Abstract:The surface modification by ultra-fast laser could regulate the mechanical properties of hard and brittle materials. Since silicon carbide (SiC) is too hard to be machined with acceptable removal rate and quality by mechanical abrasives, and femtosecond laser (fs-laser) assisted grinding could be a potential method to improve the machinability of SiC. Under fs-laser modulating, SiC surface could be modified to generate laser-induced periodic surface structures (LIPSS). Understanding the mechanical properties and material removal mechanism of the LIPPS surface is crucial to accomplish a high efficiency and quality machining process. This paper aims to investigate the effects of fs-laser modification on the mechanical properties, removal mechanism, removal efficiency, and microstructure changes of 4H-SiC surface during removal, together with those of the original 4H-SiC surface for comparison. The hardness and elastic recovery ability of the modified layer are determined by nanoindentation test, and the nano-scratch test is adopted to study the materials removal behavior. The removal efficiency and the quality of the modified surface is significantly improved. Phase transformation is observed in the scratching area, which reveals the existence of ductile mode removal. Moreover, the stress distribution and the change of scratching force on the surface of SiC before and after modification are studied by finite element method (FEM). The results show that the stress distribution and transmission when scratched on the modified surface is lower than that of the original surface, and the scratching force under the same scratch conditions is greatly reduced. With the understanding of materials removal behavior from the whole process of deformation, phase transformation, and separation of LIPPS from substrate, then the fs-laser modification of SiC could be evidenced as an effective method to improve the grinding efficiency and quality in mass production of industry.

Crystal Cleavage, Periodic Nanostructure And Surface Modification Of Sic Ablated By Femtosecond Laser In Different Media

Laser Ablation of 6H-Sic Single Crystals and Spectral Characterization

Laser ablation of RB-SiC composite by femtosecond laser irradiation

Experimental Investigation on Ablation of 4H-SiC by Infrared Femtosecond Laser

Experimental and Simulation Research on Femtosecond Laser Induced Controllable Morphology of Monocrystalline SiC

Ablation Threshold and Material Removal Mechanisms of SiC Processed by Femtosecond Laser

Femtosecond Laser-Induced Phase Transformation on Single-Crystal 6H-SiC

Study of Femtosecond Laser Ablation and Polishing Process on 4H-SiC Substrate

Materials removal mechanism of single crystalline SiC with laser-induced periodic surface structures (LIPSS)

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Experimental study on femtosecond laser ablation of 4H-SiC substrate

Laser Ablation Behavior of RB-SiC by Femtosecond Laser Irradiation

Investigation of the Morphology and Structural Transformation of 6H-Sic Induced by a Single Femtosecond Laser Pulse

Femtosecond Laser Modification of Silicon Carbide to Improve the Materials Removal Efficiency

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Investigations on the ablation behavior of C/SiC under femtosecond laser

One-Step femtosecond laser irradiation of Single-Crystal Silicon: Evolution of Micro-Nano structures and damage investigation

Study of Femtosecond Laser Ablation Effect on Micro-Processing for 4H-SiC Substrate

Removal mechanism of SiC/SiC composites by underwater femtosecond laser ablation

The ablation behavior and modification mechanism of SiC under different laser energy

Visible-Infrared Femtosecond Laser-Induced Optical Breakdown of 6H SiC