Abstract:Silicon carbide has a high hardness and corrosion resistance. Accordingly, high rate machining of this material is a big challenge to obtain good surface quality. In this work, plasma etching aided femtosecond laser micromachining was proposed to address this issue. A series of square and circular blind holes for forming SiC pressure sensor diaphragms were obtained by using a 50fs, 800 nm, 1000Hz Ti:Sapphire laser. Using the control variable method, the effects of laser machining power, scan line spacing and scanning rate on surface topography of the structure were investigated. As demonstrated by experimental results, surface roughness of the structure increases with the laser machining power within a certain range. While the scanning rate has negligible effects on surface quality of the structure. The maximum surface roughness after femtosecond laser micromachining is 2.867 μm measured by laser scanning confocal microscope, and this value is reduced to 2.143 μm after inductively coupled plasma etching. In addition, a Raman spectroscopy shows that this composite micromachining method can eliminate accumulation of amorphous carbon on SiC surface caused by the femtosecond laser processing. The reduction of surface roughness and removal of amorphous carbon can effectively decrease probability of crack failure of the sensor diaphragm and increase its deformation capability, thereby ensuring sensitivity of the sensor. The composite micromachining method fully combines the advantages of high efficiency of femtosecond laser machining and high surface quality of plasma etching, making it has high potential to be applied in precision machining of silicon carbide and fabrication of SiC sensors.

Femtosecond laser micromachining of SiC ceramic structures

Ablation Threshold and Material Removal Mechanisms of SiC Processed by Femtosecond Laser

Microstructure evolution and ablation mechanism of SiCf/SiC ceramic matrix composite microgrooves processed by pico-second laser

Mechanism and morphology control of underwater femtosecond laser microgrooving of silicon carbide ceramics.

High speed and low roughness micromachining of silicon carbide by plasma etching aided femtosecond laser processing

Character and Mechanism of Surface Micromachining for C/SiC Composites by Ultrashort Plus Laser

Experimental Study on the Influence of Ultraviolet Laser Parameters on the Microstructure Machining Quality of Silicon Carbide Ceramic

Centimeter-scale low-damage micromachining on single-crystal 4H–SiC substrates using a femtosecond laser with square-shaped Flat-Top focus spots

Processing Microgrooves and Craters on the Surface of Wide Band Gap Mold Material Using Femtosecond Laser

Parallel Grooved Microstructure Manufacturing on the Surface of Si3N4 Ceramics by Femtosecond Laser

High-Power Femtosecond Laser Processing of SiC Ceramics with Optimized Material Removal Rate

Micromachining of 4H-Sic Using Femtosecond Laser

Femtosecond Laser Modification of Silicon Carbide to Improve the Materials Removal Efficiency

Picosecond Laser Machining of Deep Holes in Silicon Infiltrated Silicon Carbide Ceramics

Water jet guided laser grooving of SiC f /SiC ceramic matrix composites

Femtosecond laser modification of silicon carbide substrates and its influence on CMP process

Investigation on the underwater femtosecond laser polishing SiC ceramic

A Review of Femtosecond Laser Processing of Silicon Carbide

355Nm DPSS UV Laser Micromachining of Single-Crystal Silicon

An experimental investigation of scan trajectory into the underwater femtosecond laser polishing SiC ceramic

Experimental Study on Femtosecond Laser Processing Performance of Single-Crystal Silicon Carbide