Abstract:To meet the continued demand for form factor reduction and functional integration of electronic devices, WLP (Wafer Level Packaging) is an attractive packaging solution with many advantages in comparison with standard BGA (Ball Grid Array) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabling more IO's, multi-chips, heterogeneous integration and 3D SiP. In particular, eWLB (Embedded Wafer Level BGA) is a fan-out WLP solution which can enable applications that require higher I/O density, smaller form factor, excellent heat dissipation, and thin package profile, and it has the potential to evolve in various configurations with proven integration flexibility, process robustness, manufacturing capacity and production yield. It also facilitates integration of multiple dies vertically and horizontally in a single package without using substrates. For eWLB fan-out WLP, the structural design as well as selection of materials is very important in determining the process yield and long term reliability. Therefore it is necessary to investigate the key design factors affecting the reliability comprehensively. This work is focused on an experimental study on the chip-package interactions in eWLB fan-out WLP with multilayer RDL's. Standard JEDEC component and board level tests were carried out to investigate reliability, and both destructive and non-destructive analyses were performed to investigate potential structural defects. Warpage, die cracking and other failures were characterized through metrology measurements and electrical tests. Board assembly processes (including SMT, underfill, etc.) were also studied. The influence of materials and structural design on the package reliability will be demonstrated. Thermal characterization and thermo-mechanical simulation results will also be discussed.

Shock Performance Study of Solder Joints in Wafer Level Packages

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections under JEDEC Standard Drop Test

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Drop failure modes of a wafer-level chip-scale packaging

Experimental Study on 28nm Chip/Package Interactions in Ewlb (embedded Wafer Level BGA) Fan-Out Wafer Level Packages

Study on Board Level Drop Reliability of Wafer Level Package

Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package

Design and Reliability in Wafer Level Packaging

Parameters study of thermomechanical reliability of board-level fan-out package

A new drop test vehicle for a uniform shock response

Shear Performance and Accelerated Reliability of Solder Interconnects for Fan-out Wafer-Level Package

Reliability Of Fine Pitch Wafer Level Packages

Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages

Effects of Design, Structure and Material on Thermal-Mechanical Reliability of Large Array Wafer Level Packages

Drop Test Simulation of 3d Stacked-Die Packaging with Input-G Finite Element Method

Finite element analysis of Sn-Ag-Cu solder joint failure under impact test

Shear Performance and Accelerated Reliability of 6 × 4 Mm2 FOWLP Solder Joints Using an ENIG PCB Electrode

Study on Board Level Drop Reliability of Wafer Level Packaging with Redistribution Structure

Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules

Effect of Thermal Shock Profile on Solder Joint of WLCSP