Abstract:Joint size effects on interfacial intermetallic compound (IMC) morphology, shear performance, and fracture behavior of micro-scale ball grid array (BGA) structure Cu/Sn–3.0Ag–0.5Cu/Cu (Cu/SAC305/Cu) joints under coupled electromechanical loads are investigated systemically by combined experimental characterization, theoretical analysis, and finite element simulation. Results show that the decreasing joint size (standoff height) brings about increase in grain size of interfacial Cu6Sn5 grains and change in morphology of the grains from rod-like to scallop-like. Decreasing standoff height also leads to an initial increase and then a decrease in shear strength of joints subjected to coupled electromechanical loads, and imposing electric current stressing on shear stress causes a significant decrease in shear strength of the joints. Current crowding appears at the interfaces near the electron entry and exit corners of the joints, and the localized maximum current density in large joints with rough solder/IMC interface is higher than that of small joints. There is a distinct size effect on fracture mode and facture path of BGA joints under coupled electromechanical loads. For large joints, the crack initiates and propagates simultaneously at the interfaces on both cathode and anode sides, and fracture is more likely to take place by a brittle mode mainly along the solder/IMC interface on both sides; while for small joints, the crack preferentially initiates and propagates at the interface on the cathode side, leading to final fracture occurring mainly on the cathode side and partially on the anode side. This study provides a better understanding on the shear performance and fracture behavior as well as the underlying mechanism of BGA solder joints with different sizes, thereby being highly significant for reliability assessment and lifetime prediction of BGA packages.

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