Abstract:The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a 'concave' warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.

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Design and Reliability in Wafer Level Packaging

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Experimental Study on 28nm Chip/Package Interactions in Ewlb (embedded Wafer Level BGA) Fan-Out Wafer Level Packages

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Research of Temperature Cycling Reliability of Wafer Level Packages with Redistribution Layer

Reliability of RDL Structured Wafer Level Packages

Reliability challenges and design considerations for Wafer-Level packages

Analysis of warpage and reliability of very thin profile fine pitch ball grid array

Study on Board Level Drop Reliability of Wafer Level Package

Reliability Of Fine Pitch Wafer Level Packages

Parameters study of thermomechanical reliability of board-level fan-out package

Shock Performance Study of Solder Joints in Wafer Level Packages

Design Guideline on Board-Level Thermomechanical Reliability of 2.5D Package

Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

Comprehensive Characterization of Warpage and Fatigue Performance of Fan-out Wafer Level Package by Taking into Account the Viscoelastic Behavior of EMC and the Dielectric Layer

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Thermal Performance And Reliability Management For Novel Power Electronic Packaging Using Integrated Base Plate

Thermal-mechanical Reliability Analysis of Connection Structure Between Redistribution Layer and TSV for MEMS Packaging

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