Abstract:Solder joint reliability suffers great challenges due to high current density and miniature solder bump diameter of electronic packages at cryogenic temperature. To tackle these issues, the solder microstructure evolution and the corresponding failure mechanism should be emphasized. In this study, the current-induced microstructure characteristics and mechanical behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints during thermal shock process was thoroughly addressed over cycles by combining diffusional, electrical, thermal and mechanical features. This result verified that the combining method of thermal shock and electromigration (EM) contributed to the atom diffusion and high thermal stress formation, further causing intermetallic compound (IMC) growth, the repaid dissolution of Cu pad and high thermal stress of the solder joints. High stress induced by either the thermal expansion mismatch of different component, large temperature change (ΔT =346 °C) and severe lattice distortion became the direct reason for twins and cracks formation of SAC305 solder joints. The combination of crack propagated along the interface and the quick dissolution of Cu substrate at the corner accelerated the eventually failure of the solder joints. Moreover, as the thermal chock cycles was extended, the initiation and propagation of cracks at the cathode side weaken the cathodic shear strength. High stress-induced twin formation at the interface effectively moderated the shear strength degradation due to anode IMC growth after 9 cycles. This study contributed to thoroughly grasp the failure mechanism of the solder joints and design the twin-strengthened Sn-based solder joints under the coupling effects of extreme temperature variation and current stressing.

Effect of Thermal Shock Profile on Solder Joint of WLCSP

Board Level Wlcsp 3d Thermal Stress Analysis By Submodeling Of Fea

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Effect of Micro-Solder Joint Structure Parameters on Its Thermal Stress in WLCSP

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Finite Element Analyses and Lifetime Predictions for Snagcu Solder Interconnections in Thermal Shock Tests

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Effect of Thermal Cycling on the Strain and Stress Distribution of TSVs and Solder Bumps in Stacked Package Structure

Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging

Effects of Package Geometry on Thermal Fatigue Life and Microstructure of Sn–Ag–Cu Solder Joint

Thermal Cycle Failure Behavior of SAC305/SnPb Micro-Hybrid Solder Joints: an Experimental and Finite Element Simulation Approach

Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

Parameters study of thermomechanical reliability of board-level fan-out package

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly

Influence of Under-Bump Metallurgy and Solder Alloys on the Crack in the Wafer Level Chip Scale Packaging

Accelerative Reliability Tests for Sn3.0Ag0.5Cu Solder Joints under Thermal Cycling Coupling with Current Stressing

Prediction on Response to the Thermal Fatigue of Through-Hole Solder Joint I. Experimental Research of Solder Joint Response to the Thermal Fatigue

Effect of Ag Content on Microstructure and Mechanical Properties of Sn-xAg-0.5Cu Solder Joints under Rapid Thermal Shock

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

The Influence of Solder on the Thermal Stress in a FCOL Device