Abstract:This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G with a pulse duration of 0.3 ms. Half of the test boards without edge bonding were subjected to drop tests at a peak acceleration of 900 G with a pulse duration of 0.7 ms, and the other half subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms. Two drop test failure detection systems were used in this study to monitor the failure of solder joints: a high-speed resistance measurement system and a post-drop static resistance measurement system. The high-speed resistance measurement system, which has a scan frequency of 50 KHz and a 16-bit signal width, is able to detect intermittent failures during the short drop impact duration. Statistics of the number of drops to failure for the 15 component locations on each test board are reported. The effect of component position on drop test reliability is discussed. The test results show that the drop test performance of edge-bonded CSPs is five to eight times better than the CSPs without edge bonding. However, the drop test reliability of edge-bonded CSPs with the thermal-cured epoxy is different from that with edge-bonded CSPs with the UV-cured acrylic. The solder crack location and crack area are characterized with the dye penetrant method. The fracture surfaces are studied using scanning electron microscopy (SEM).

Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections under JEDEC Standard Drop Test

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package

Efficient Multi-Level Modeling Technique for Determining Effective Board Drop Reliability of PCB Assembly

Shock Performance Study of Solder Joints in Wafer Level Packages

An alternative JEDEC test board design and analysis

Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules

Modal Analysis Of Board-Level Electronic Package

Experimental investigation on the failure of lead-free solder joints under drop impact

Drop failure modes of a wafer-level chip-scale packaging

Drop test reliability of lead-free chip scale packages

Reliability Study of Board-Level Lead-Free Interconnections under Sequential Thermal Cycling and Drop Impact.

Failure Analysis of BGA Lead-free Solder Joints under Drop Impact

Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages

Research on Reliability of Board Level Package-On-Package in Drop Test

Drop Test Simulation of 3d Stacked-Die Packaging with Input-G Finite Element Method

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Study on Board Level Drop Reliability of Wafer Level Package

Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA Packages

Reliability Analysis of Different Structure Parameters of PCBA under Drop Impact