Abstract:This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of the edge-bonded test boards were subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms, and the other half subjected to drop tests at a peak acceleration of 2900 G with a pulse duration of 0.3 ms. Half of the test boards without edge bonding were subjected to drop tests at a peak acceleration of 900 G with a pulse duration of 0.7 ms, and the other half subjected to drop tests at a peak acceleration of 1500 G with a pulse duration of 0.5 ms. Two drop test failure detection systems were used in this study to monitor the failure of solder joints: a high-speed resistance measurement system and a post-drop static resistance measurement system. The high-speed resistance measurement system, which has a scan frequency of 50 KHz and a 16-bit signal width, is able to detect intermittent failures during the short drop impact duration. Statistics of the number of drops to failure for the 15 component locations on each test board are reported. The effect of component position on drop test reliability is discussed. The test results show that the drop test performance of edge-bonded CSPs is five to eight times better than the CSPs without edge bonding. However, the drop test reliability of edge-bonded CSPs with the thermal-cured epoxy is different from that with edge-bonded CSPs with the UV-cured acrylic. The solder crack location and crack area are characterized with the dye penetrant method. The fracture surfaces are studied using scanning electron microscopy (SEM).

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

A Comparative Study on Drop Test Performance of Fine Pitch BGA Assemblies Using Pb-free and Tin-lead Solders

Drop test reliability of lead-free chip scale packages

Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections under JEDEC Standard Drop Test

Board Level Drop Test Analysis Based on Modal Test and Simulation

Drop performance evaluation for application of different underfill processes

Dropping Simulation of Printed Circuit Board with Bga Soldering Assembly for Optical Module Application

Drop failure modes of a wafer-level chip-scale packaging

Study on the board-level drop test of the stacked memory device by FEA

A new drop test vehicle for a uniform shock response

Study on the board-level drop test of WLCSP with RDL by finite element analysis

Modeling and Simulation of PCB Assembly under Board-Level Drop Impact

Drop Test Simulation of 3d Stacked-Die Packaging with Input-G Finite Element Method

Efficient Multi-Level Modeling Technique for Determining Effective Board Drop Reliability of PCB Assembly

Drop failure modes of Sn–3.0Ag–0.5Cu solder joints in wafer level chip scale package

Research on Reliability of Board Level Package-On-Package in Drop Test

Failure Analysis of BGA Lead-free Solder Joints under Drop Impact

Investigation for the Response of PCB Assembly with Five POP Packages During Dropping