High-Performance Zno Nanowire Field-Effect Transistor With Forming Gas Treated Sio2 Gate Dielectrics
haolei qian,yewu wang,yanjun fang,lin gu,ren lu,jian sha
DOI: https://doi.org/10.1063/1.4919220
IF: 2.877
2015-01-01
Journal of Applied Physics
Abstract:The SiO2 films thermally grown on Si wafer have been annealed in forming atmosphere (N-2:H-2 = 9:1) prior to use as gate insulators in ZnO nanowire field effect transistors (ZnO NW-FETs). Without the annealing process, ZnO NW-FETs exhibit very poor performance, and most of them even cannot be depleted under a high gate voltage of 100 V; however, with the annealing process in forming atmosphere, the device characteristics can be significantly improved, exhibiting a large turn on-off ratio of similar to 10(4) and a low sub-threshold swing similar to 1 V/decade. The pre-annealing treatment of SiO2 (300 nm)/p-Si in N-2/H-2 ambient may significantly reduce the number of nonbridging oxygen atoms, which blocks the interaction between ZnO nanowires and SiO2 surface, and finally enhances the electrical characteristics of the back-gated ZnO NW-FETs. In addition, the FET electrode fabrication process introduced in this paper is much simpler than the traditional photo-lithography and lift-off method, which has potential applications in future device fabrication. (C) 2015 AIP Publishing LLC.