Abstract:Reliability issues associated with thermal-humidity and vapor pressure have become increasingly significant for electronic devices. With the more density of the electronic packaging and the trend of lead-free material application, the film between IC and substrate will experience more harsh stress condition in the packaging process. The interface delamination is caused by these factors. Therefore, it is important to develop numerical implementation for the study of delamination mechanism. This paper presents a combined numerical methodology for predicting the thermal-humidity behavior of the process of electronic packaging. Firstly, the sequentially coupled thermal-mechanics finite element model has been applied to simulate the process of Chip on Glass (COG) packaging. Secondly, the moisture absorption and desorption have been investigated by numerical approaches. The direct concentration approach (DCA) which is able to settle the issue on the discontinuity of moisture concentration at interfaces between two materials which have distinct saturated moisture concentrations is applied in a bio-material system. Currently, commercial finite element method software such as ABAQUS is of the modulus of mass diffusion which is competent to achieve the DCA. According to the simulation, the numerical results have very good agreement with experimental data on the distribution of moisture concentrations. Further in this paper, the vapor pressure has been predicted in terms of the whole-field vapor pressure model which is put forward by Fan and the simplified Fan's vapor pressure model respectively. Compared with the results of these two models, the former one is more precise but less efficient than the latter one. At last, hygroscopic stress and thermal stress are calculated in terms of former numerical analysis and compared with the vapor pressure during the reflow process. It is reasonable to consider the vapor pressure as a major factor of failure during the reflow process by comparison.

Analysis Of The Packaging Stresses In Monolithic Multi-Sensor

Residual Stresses in Monolithic Multi-Sensor Package

Thermal stress of MOEMS Accelerometers Based on Grating Interferometric cavity

Hybrid Packaging of A Monolithic Multi-Sensor

Investigation on the effect of the packaging-induced stress on the reliability of a MEMS sensor package

Measurement of Thermal Stress in Cob Packaging Structures

Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction Simulations

Study on Package Thermal Stress of Multi-ranged Micro-accelerometer

The Influence of the Thermal Stress on a Pressure Sensor in Integrated Weather Multi-Sensor Chip

Study on Packaging Thermal Stress of Micromechanical Silicon Resonant Accelerometer

Research on the Stress in Stacked Chip Packages

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

Packaging Effect on MEMS Pressure Sensor Performance

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Effect of Residual Stress on the Performance of Self-Packaging Piezoresistive Pressure Sensor in Wireless Capsule

Design and Fabrication of a MEMS Temperature and Pressure Integrated Sensor with Back-Inlet Package Structure

A Numerical Method On Thermal-Humidity Behavior Of Electronic Packaging

Low stress packaging of a micromachined accelerometer

Application of silicon stress sensor in flip chip packaging system

Hygrothermal Stress Analysis for a Micro-Camera Module under the Moisture Sensitivity Level One

Measurement of Elastic Thermal Stress in COB Packaging Structures